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Time of issue:2020-07-15 00:00:00
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Introduction to the production steps and requirements of PCBA test racks
Introduction
The PCBA test stand, as the name suggests, is a device for testing the finished PCBA. However, many PCBA test racks now only add a few pressure plate buckles to the rack, and use thimble and pressure plate buckles to fix the PCBA. In the PCBA function test, the PCBA is pressed into the pressure plate buckle with both hands for the test, but this test method often causes the PCBA to be unevenly stressed or not pressed down in place, resulting in poor contact between the test pin and the PCBA. It also largely affects the test efficiency and accuracy. If the PCBA is pressed down with too much force, it is not only easy to deform or damage the PCBA, but also to damage the test pins of the test frame.
Therefore, the best solution to the above test problems is to make...
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The PCBA test stand, as the name suggests, is a device for testing the finished PCBA. However, many PCBA test racks now only add a few pressure plate buckles to the rack, and use thimble and pressure plate buckles to fix the PCBA. In the PCBA function test, the PCBA is pressed into the pressure plate buckle with both hands for the test, but this test method often causes the PCBA to be unevenly stressed or not pressed down in place, resulting in poor contact between the test pin and the PCBA. It also largely affects the test efficiency and accuracy. If the PCBA is pressed down with too much force, it is not only easy to deform or damage the PCBA, but also to damage the test pins of the test frame.
Therefore, the best solution to the above test problems is to make...
What are the advantages of SMT patch
What
In the previous article, we have mentioned the introduction of SMT, and we know that it is the most popular technology and process in the electronic assembly industry. The rapid development of SMT patch is due to its own advantages. The following Sanjing will take you to understand some of the advantages of SMT patch.
First of all, the first advantage is high assembly density, light weight and small size of electronic products. Chip components are much smaller in mass and volume than traditional perforated components. Generally, SMT assembly technology can reduce the mass and volume of electronic products by a large proportion.
The second is strong vibration resistance and high reliability. Why do you say that? The reason is very simple, because the electronic components are short or no leads, and are firmly mounted on the PCB surface, so the SMT patch has better vibration resistance and reliability. It is worth mentioning here...
See more information
In the previous article, we have mentioned the introduction of SMT, and we know that it is the most popular technology and process in the electronic assembly industry. The rapid development of SMT patch is due to its own advantages. The following Sanjing will take you to understand some of the advantages of SMT patch.
First of all, the first advantage is high assembly density, light weight and small size of electronic products. Chip components are much smaller in mass and volume than traditional perforated components. Generally, SMT assembly technology can reduce the mass and volume of electronic products by a large proportion.
The second is strong vibration resistance and high reliability. Why do you say that? The reason is very simple, because the electronic components are short or no leads, and are firmly mounted on the PCB surface, so the SMT patch has better vibration resistance and reliability. It is worth mentioning here...
Small home pcba small class explanation: board circuit from China manufacturer's compatible design knowledge!
Small
Choose a reasonable wire width. The impact interference caused by the transient current on the printed lines of the PCB board circuit from China manufacturer is mainly caused by the inductance of the printed wires. Therefore, the inductance of the printed wires should be minimized.
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Choose a reasonable wire width. The impact interference caused by the transient current on the printed lines of the PCB board circuit from China manufacturer is mainly caused by the inductance of the printed wires. Therefore, the inductance of the printed wires should be minimized.
Why does the PCBA board cock up?
Why
We know that PCBA boards are easily deformed due to various factors during reflow soldering or wave soldering, resulting in poor PCBA soldering. Poor soldering has become a common problem in PCBA production. Once a poor soldering phenomenon occurs, it will cause our products to malfunction and sometimes even fail to operate normally. This is a headache for production personnel. Today, Sanjing will take you to understand the causes of PCBA board deformation (uplifting).
1. The furnace temperature, each circuit board has a maximum TG value. When the reflow soldering temperature is higher than the maximum TG value of the circuit board, it will cause the board to soften and deform.
Second, it is the PCB board problem. With the popularity of lead-free technology, the furnace temperature is higher than the lead temperature, so the requirements for the sheet are getting higher and higher. The lower the TG value of the board, the easier it is to deform when passing...
See more information
We know that PCBA boards are easily deformed due to various factors during reflow soldering or wave soldering, resulting in poor PCBA soldering. Poor soldering has become a common problem in PCBA production. Once a poor soldering phenomenon occurs, it will cause our products to malfunction and sometimes even fail to operate normally. This is a headache for production personnel. Today, Sanjing will take you to understand the causes of PCBA board deformation (uplifting).
1. The furnace temperature, each circuit board has a maximum TG value. When the reflow soldering temperature is higher than the maximum TG value of the circuit board, it will cause the board to soften and deform.
Second, it is the PCB board problem. With the popularity of lead-free technology, the furnace temperature is higher than the lead temperature, so the requirements for the sheet are getting higher and higher. The lower the TG value of the board, the easier it is to deform when passing...
The difference between PCBA processing reflow soldering and wave soldering
The
In PCBA processing, the two most common soldering methods are reflow soldering and wave soldering. So what exactly are they? What is the role of each? Let's take a brief look at the following Sanjing belts.
First, let's take a look at reflow soldering. Reflow soldering refers to the electrical interconnection of the pins or solder ends of the electronic components pre-mounted on the pads with the pads on the PCB by heating and melting the solder paste pre-coated on the pads to achieve the electronic The purpose of soldering components on the PCB board. Reflow soldering is generally divided into three parts: preheating zone, heating zone and cooling zone.
Reflow soldering process:...
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In PCBA processing, the two most common soldering methods are reflow soldering and wave soldering. So what exactly are they? What is the role of each? Let's take a brief look at the following Sanjing belts.
First, let's take a look at reflow soldering. Reflow soldering refers to the electrical interconnection of the pins or solder ends of the electronic components pre-mounted on the pads with the pads on the PCB by heating and melting the solder paste pre-coated on the pads to achieve the electronic The purpose of soldering components on the PCB board. Reflow soldering is generally divided into three parts: preheating zone, heating zone and cooling zone.
Reflow soldering process:...
SMT common defects and their causes
SMT
We know that whether it is SMT patch or PCBA production, there will be more or less bad situations. Today, Sanjing mainly takes you to understand the common defects and their causes in SMT.
Common defects in SMT mainly include: solder ball, tombstone, short circuit, offset, low solder/open circuit, etc. Below we will introduce the causes of these defects in turn.
1. Tin ball. 1. Before printing, the solder paste has not been fully warmed to thaw, or has not been stirred evenly. 2. If there is no reflow for too long after printing, the solvent will evaporate, and the paste will become dry powder and fall onto the ink. 3. The printing is too thick, and the excess solder paste overflows after the component is pressed down. 4. The mounting pressure is too large, and the downward pressure causes the solder paste to...
See more information
We know that whether it is SMT patch or PCBA production, there will be more or less bad situations. Today, Sanjing mainly takes you to understand the common defects and their causes in SMT.
Common defects in SMT mainly include: solder ball, tombstone, short circuit, offset, low solder/open circuit, etc. Below we will introduce the causes of these defects in turn.
1. Tin ball. 1. Before printing, the solder paste has not been fully warmed to thaw, or has not been stirred evenly. 2. If there is no reflow for too long after printing, the solvent will evaporate, and the paste will become dry powder and fall onto the ink. 3. The printing is too thick, and the excess solder paste overflows after the component is pressed down. 4. The mounting pressure is too large, and the downward pressure causes the solder paste to...
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