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Time of issue:2020-07-15 00:00:00
SMT贴片机的发展方向及趋势
2022-01-05
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...
Knowledge about SMT equipment maintenance
2021-12-21
Hardware is the foundation of the entire SMT. Without hardware equipment, there will be no process and program. This is also true in practical applications. However, under normal circumstances, people are generally more concerned about the SMT process than the hardware and the program. The following Sanjing will take you to understand:
Most of the manufacturing process is controlled by the temperature profile (PROFILE), and the adjustment of the temperature profile is also based on the hardware. However, sometimes due to patching, there may be problems in the manufacturing process, and most of the problems caused by patching are related to hardware. Therefore, SMT equipment maintenance is essential. If the SMT equipment is properly...
Hardware is the foundation of the entire SMT. Without hardware equipment, there will be no process and program. This is also true in practical applications. However, under normal circumstances, people are generally more concerned about the SMT process than the hardware and the program. The following Sanjing will take you to understand:
Most of the manufacturing process is controlled by the temperature profile (PROFILE), and the adjustment of the temperature profile is also based on the hardware. However, sometimes due to patching, there may be problems in the manufacturing process, and most of the problems caused by patching are related to hardware. Therefore, SMT equipment maintenance is essential. If the SMT equipment is properly...
PCB component layout and pad design
2021-12-21
(1) PCB component layout
① The components on the PCB should be evenly distributed, and the high-power components should be dispersed to avoid local overheating on the PCB when the circuit is working, which will affect the reliability of the solder joints.
②For double-sided mounting components, the larger components on both sides should be installed in a...
(1) PCB component layout
① The components on the PCB should be evenly distributed, and the high-power components should be dispersed to avoid local overheating on the PCB when the circuit is working, which will affect the reliability of the solder joints.
②For double-sided mounting components, the larger components on both sides should be installed in a...
What are the characteristics of SMT patch processing and assembly
①High density: As the number of pins processed by SMT chip can reach hundreds or even thousands, and the center distance between pins can reach 0.3mm, the high-precision BGA on the circuit board requires fine lines and fine spacing, and the line width ranges from 0.2 to 0.3 The mm has been reduced to 0.1mm or even 0.05mm, and the 2.54mm grid has developed to 4, 5 or even 6 wires. The fine line and fine pitch greatly improve the assembly density of SMT, and the corresponding SMT processing plant can complete the corresponding SMT processing equipment with high precision.
②Small aperture: Most of the metallized holes in SMT are not used to insert component pins, and no welding is...
①High density: As the number of pins processed by SMT chip can reach hundreds or even thousands, and the center distance between pins can reach 0.3mm, the high-precision BGA on the circuit board requires fine lines and fine spacing, and the line width ranges from 0.2 to 0.3 The mm has been reduced to 0.1mm or even 0.05mm, and the 2.54mm grid has developed to 4, 5 or even 6 wires. The fine line and fine pitch greatly improve the assembly density of SMT, and the corresponding SMT processing plant can complete the corresponding SMT processing equipment with high precision.
②Small aperture: Most of the metallized holes in SMT are not used to insert component pins, and no welding is...
SMT welding inspection and defect effects
2021-11-02
After the SMT welding operation is over, in order to make the product have reliable performance, the welding quality must be inspected. Welding inspection is generally a visual inspection, not just to inspect the solder joints, but also to check the conditions around the solder joints. For example: due to a series of problems caused by welding, the inspection of the wiring and welding of the terminal is to check from the welding state, ①check whether the...
After the SMT welding operation is over, in order to make the product have reliable performance, the welding quality must be inspected. Welding inspection is generally a visual inspection, not just to inspect the solder joints, but also to check the conditions around the solder joints. For example: due to a series of problems caused by welding, the inspection of the wiring and welding of the terminal is to check from the welding state, ①check whether the...
Advantages and disadvantages of SMT chip processing BGA
BGA is a packaging method for SMT chip processing. BGA is the abbreviation of Ball Grid Array in English. With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, stronger performance requirements, smaller volume requirements, and lighter weight requirements. This has promoted the trend of electronic products. Multifunctional, high-performance, miniaturization and light-weight development. In order to achieve this goal, the size of IC chips is getting smaller and smaller, and the complexity is increasing. Therefore, the number of...
BGA is a packaging method for SMT chip processing. BGA is the abbreviation of Ball Grid Array in English. With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, stronger performance requirements, smaller volume requirements, and lighter weight requirements. This has promoted the trend of electronic products. Multifunctional, high-performance, miniaturization and light-weight development. In order to achieve this goal, the size of IC chips is getting smaller and smaller, and the complexity is increasing. Therefore, the number of...
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