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Time of issue:2020-07-15 00:00:00
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Why does the PCBA board cock up?
Why
We know that PCBA boards are easily deformed due to various factors during reflow soldering or wave soldering, resulting in poor PCBA soldering. Poor soldering has become a common problem in PCBA production. Once a poor soldering phenomenon occurs, it will cause our products to malfunction and sometimes even fail to operate normally. This is a headache for production personnel. Today, Sanjing will take you to understand the causes of PCBA board deformation (uplifting).
1. The furnace temperature, each circuit board has a maximum TG value. When the reflow soldering temperature is higher than the maximum TG value of the circuit board, it will cause the board to soften and deform.
Second, it is the PCB board problem. With the popularity of lead-free technology, the furnace temperature is higher than the lead temperature, so the requirements for the sheet are getting higher and higher. The lower the TG value of the board, the easier it is to deform when passing...
See more information
We know that PCBA boards are easily deformed due to various factors during reflow soldering or wave soldering, resulting in poor PCBA soldering. Poor soldering has become a common problem in PCBA production. Once a poor soldering phenomenon occurs, it will cause our products to malfunction and sometimes even fail to operate normally. This is a headache for production personnel. Today, Sanjing will take you to understand the causes of PCBA board deformation (uplifting).
1. The furnace temperature, each circuit board has a maximum TG value. When the reflow soldering temperature is higher than the maximum TG value of the circuit board, it will cause the board to soften and deform.
Second, it is the PCB board problem. With the popularity of lead-free technology, the furnace temperature is higher than the lead temperature, so the requirements for the sheet are getting higher and higher. The lower the TG value of the board, the easier it is to deform when passing...
Easily overlooked links in SMT patch processing
Easily
In the process of SMT patch production and processing, we generally do not notice many details. In addition to production, the most easily overlooked thing is product packaging. Product packaging is also divided into different types, such as ordinary packaging and anti-static packaging.
Generally speaking, the corresponding cost of different packaging is also different. For example, anti-static packaging is usually more expensive than ordinary packaging. For many high-precision products, we should not only pay attention to the quality of the SMT patch, but also pay attention to the packaging of the product. We have also introduced the knowledge about the generation and existence of static electricity. If we do not...
See more information
In the process of SMT patch production and processing, we generally do not notice many details. In addition to production, the most easily overlooked thing is product packaging. Product packaging is also divided into different types, such as ordinary packaging and anti-static packaging.
Generally speaking, the corresponding cost of different packaging is also different. For example, anti-static packaging is usually more expensive than ordinary packaging. For many high-precision products, we should not only pay attention to the quality of the SMT patch, but also pay attention to the packaging of the product. We have also introduced the knowledge about the generation and existence of static electricity. If we do not...
Why PCBA processing solder joints will fail
Why
Nowadays, with the continuous development of electronic products in the direction of miniaturization, lightness and thinness, the entire electronic industry has become more and more stringent on the reliability of PCBA. As the volume of electronic products becomes smaller, the volume of PCBA boards is getting smaller and smaller, and the density of PCBA processing and assembly is getting higher and higher. At the same time, it also means that the solder joints of the circuit board are getting smaller and smaller. It is precisely because the solder joints become smaller that many process details are difficult to control and deal with in place, so we often encounter the problem of PCBA solder joint failure in the daily processing. So, what are...
See more information
Nowadays, with the continuous development of electronic products in the direction of miniaturization, lightness and thinness, the entire electronic industry has become more and more stringent on the reliability of PCBA. As the volume of electronic products becomes smaller, the volume of PCBA boards is getting smaller and smaller, and the density of PCBA processing and assembly is getting higher and higher. At the same time, it also means that the solder joints of the circuit board are getting smaller and smaller. It is precisely because the solder joints become smaller that many process details are difficult to control and deal with in place, so we often encounter the problem of PCBA solder joint failure in the daily processing. So, what are...
How to avoid welding defects in SMT chip processing
How
In SMT chip processing, most of the defects are caused by solder paste defects. For this kind of production details, we can organize the BOM and Gerber data from the beginning, to the management of the procurement channel of the components, the storage and access control of the solder paste, solder paste printing, SPI solder paste inspection, reflow soldering, etc. Strict control to reduce or avoid soldering defects caused by solder paste problems.
In addition, in PCBA processing, because the same batch of products may have thousands of pieces, the chip processing cycle is relatively long, there may be dry solder paste on the template stencil, or the template opening and the circuit board may not be aligned. Such details may cause unwanted solder paste to be generated at the bottom of the template or even during the processing of PCBA foundry materials, resulting in poor soldering. Next...
See more information
In SMT chip processing, most of the defects are caused by solder paste defects. For this kind of production details, we can organize the BOM and Gerber data from the beginning, to the management of the procurement channel of the components, the storage and access control of the solder paste, solder paste printing, SPI solder paste inspection, reflow soldering, etc. Strict control to reduce or avoid soldering defects caused by solder paste problems.
In addition, in PCBA processing, because the same batch of products may have thousands of pieces, the chip processing cycle is relatively long, there may be dry solder paste on the template stencil, or the template opening and the circuit board may not be aligned. Such details may cause unwanted solder paste to be generated at the bottom of the template or even during the processing of PCBA foundry materials, resulting in poor soldering. Next...
Why are voids generated in SMT patch processing
Why
Before introducing the reasons for the voids in SMT patches, I will give you a brief introduction to the voids. That is, the micro-holes at the welding interface. Such voids are so small that they can only be found by scanning electron microscopy (SEM). The location and distribution of the voids may be the potential cause of electrical connection failure. If the micro-holes are not reserved or the location of the micro-holes is incorrect, voids may occur, especially for power components, which will increase the thermal resistance of the components and cause failure.
At the same time, the existence of voids will also oxidize the product, which will lead to faster product aging. So, how do the hollows in SMT patch processing occur?
Studies have shown that the...
See more information
Before introducing the reasons for the voids in SMT patches, I will give you a brief introduction to the voids. That is, the micro-holes at the welding interface. Such voids are so small that they can only be found by scanning electron microscopy (SEM). The location and distribution of the voids may be the potential cause of electrical connection failure. If the micro-holes are not reserved or the location of the micro-holes is incorrect, voids may occur, especially for power components, which will increase the thermal resistance of the components and cause failure.
At the same time, the existence of voids will also oxidize the product, which will lead to faster product aging. So, how do the hollows in SMT patch processing occur?
Studies have shown that the...
Why the PCB board is prone to failure
Why
We know that, under normal circumstances, industrial PCB boards often need to be repaired. When repairing, it is necessary to check and understand the vulnerable parts on the circuit board. What is the reason that the circuit board components are fragile? The following Sanjing take everyone to understand.
First of all, the design is unreasonable. If the circuit board design is unreasonable, it is easy to cause the circuit board heat dissipation problem. Many circuit board damages are caused by poor heat dissipation design; secondly, the copper foil wire design of the circuit board is too thin, and it is easy to burn out due to overcurrent, which makes the main board. can not work.
Second, it is used frequently. For example, the drive motor of the circuit board, the rotating shaft, the switch tube of the switching power supply, and the commonly used buttons of the operation panel...
See more information
We know that, under normal circumstances, industrial PCB boards often need to be repaired. When repairing, it is necessary to check and understand the vulnerable parts on the circuit board. What is the reason that the circuit board components are fragile? The following Sanjing take everyone to understand.
First of all, the design is unreasonable. If the circuit board design is unreasonable, it is easy to cause the circuit board heat dissipation problem. Many circuit board damages are caused by poor heat dissipation design; secondly, the copper foil wire design of the circuit board is too thin, and it is easy to burn out due to overcurrent, which makes the main board. can not work.
Second, it is used frequently. For example, the drive motor of the circuit board, the rotating shaft, the switch tube of the switching power supply, and the commonly used buttons of the operation panel...
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