Before introducing the advantages and disadvantages of BGA, Sanjing will give you a brief understanding of BGA:

BGA is a packaging method for SMT chip processing. BGA is the abbreviation of Ball Grid Array in English. With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, stronger performance requirements, smaller volume requirements, and lighter weight requirements. This has promoted the trend of electronic products. Multifunctional, high-performance, miniaturization and light-weight development. In order to achieve this goal, the size of IC chips is getting smaller and smaller, and the complexity is increasing. Therefore, the number of I/Os in the circuit will increase, and the I/O density of the package will also continue to increase. In order to adapt to this development Requirements, some advanced high-density packaging technologies came into being, BGA packaging technology is one of them.

However, there are many problems that need to be paid attention to during the BGA welding process: ① In the welding process of BGA devices, if the steel mesh is thick, it is easy to cause tinning.

② The pin spacing of BGA devices is small, so the metal material particles in the solder paste used are also required to be small, because too large metal particles will cause the SMT process to appear even tin.

③In the process of SMT patch processing, a reflow oven is generally used. Before BGA packaged components are soldered, the temperature of each area must be set in accordance with the processing regulations and the temperature around the solder joints must be detected by the thermal resistance camera.

④ After SMT processing, the BGA packaged devices should be strictly tested to prevent some chip-type defects from appearing.

Next, I will mainly introduce the advantages and disadvantages of BGA packaging:

(1) Advantages of BGA packaging:

① reduced volume and quality; ② improved assembly yield; ③ improved electro-thermal performance; ④ small signal transmission delay; ⑤ increased frequency of use; ⑥ products High credibility.

(2) Disadvantages of BGA packaging:

①The cost of electronic production increases; ②The inspection after soldering must be based on X-ray; ③The cost of repairing increases.

The above is about the advantages and disadvantages of SMT chip BGA packaging, I hope it can be helpful to everyone!