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Time of issue:2020-07-15 00:00:00
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Common causes and solutions for PCBA pseudo welding
Common
In the PCBA processing process, pseudo soldering is an important reason that affects the quality of the circuit board. PCBA pseudo welding is also called cold welding. From the surface, there is no problem with welding, but the actual internal components are not connected, or the internal connection is unstable, which affects the circuit characteristics, resulting in unqualified PCB circuit boards or even scrapped. In addition, if false welding occurs, it needs to be reprocessed, which will not only increase labor pressure, but also reduce production efficiency and bring losses to the enterprise. Therefore, we must pay attention to the PCBA pseudo-welding phenomenon.
Let’s take a look at the common causes and solutions of PCBA pseudo-welding in the following Sanjing:
PCBA pseudo-soldering is a common circuit error. There are two common reasons for ...
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In the PCBA processing process, pseudo soldering is an important reason that affects the quality of the circuit board. PCBA pseudo welding is also called cold welding. From the surface, there is no problem with welding, but the actual internal components are not connected, or the internal connection is unstable, which affects the circuit characteristics, resulting in unqualified PCB circuit boards or even scrapped. In addition, if false welding occurs, it needs to be reprocessed, which will not only increase labor pressure, but also reduce production efficiency and bring losses to the enterprise. Therefore, we must pay attention to the PCBA pseudo-welding phenomenon.
Let’s take a look at the common causes and solutions of PCBA pseudo-welding in the following Sanjing:
PCBA pseudo-soldering is a common circuit error. There are two common reasons for ...
Factors affecting PCBA processing tin penetration
Factors
In the PCBA processing process, especially the through-hole plug-in process, if the PCB board is not penetrated well, it is easy to cause problems such as virtual soldering, tin cracking and even dropouts, which will increase the cost of repair. Therefore, the choice of PCBA tin penetration is very important. So the question is, what factors will affect PCBA tin penetration? Let's take a look at the following Sanjing:
Before introducing the factors that affect PCBA processing tin penetration, let's first understand the PCBA tin penetration requirements: According to the IPC standard, the PCBA tin penetration requirements of through-hole solder joints are generally more than 75%, that is, the solder penetration standard for the appearance inspection of the panel surface Not less than 75% of the hole height ...
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In the PCBA processing process, especially the through-hole plug-in process, if the PCB board is not penetrated well, it is easy to cause problems such as virtual soldering, tin cracking and even dropouts, which will increase the cost of repair. Therefore, the choice of PCBA tin penetration is very important. So the question is, what factors will affect PCBA tin penetration? Let's take a look at the following Sanjing:
Before introducing the factors that affect PCBA processing tin penetration, let's first understand the PCBA tin penetration requirements: According to the IPC standard, the PCBA tin penetration requirements of through-hole solder joints are generally more than 75%, that is, the solder penetration standard for the appearance inspection of the panel surface Not less than 75% of the hole height ...
What are the basic elements of SMT assembly
What
SMT is the abbreviation of surface mount technology, a PCB assembly technology, which refers to the technology of soldering components directly to the surface of the PCB to replace THT, which requires the use of drilling. When SMT assembly is used in electronic manufacturing, components with short or no leads (SMC/SMD) are placed on the corresponding position on the circuit board or substrate, and then reflow soldering or wave soldering is used to permanently fix the component on the board.
(1) SMT attributes
①Miniaturization: SMC/SMD has the characteristics of light weight, small size and high installation accuracy. Therefore, the volume of the final product using SMT can be reduced by 40% to 60%, and the weight can be reduced by 60% to 80%. ②High performance: The components in the SMT assembly have a low rejection rate and higher vibration resistance. ③High reliability: Electronic products using SMT components have high frequencies...
See more information
SMT is the abbreviation of surface mount technology, a PCB assembly technology, which refers to the technology of soldering components directly to the surface of the PCB to replace THT, which requires the use of drilling. When SMT assembly is used in electronic manufacturing, components with short or no leads (SMC/SMD) are placed on the corresponding position on the circuit board or substrate, and then reflow soldering or wave soldering is used to permanently fix the component on the board.
(1) SMT attributes
①Miniaturization: SMC/SMD has the characteristics of light weight, small size and high installation accuracy. Therefore, the volume of the final product using SMT can be reduced by 40% to 60%, and the weight can be reduced by 60% to 80%. ②High performance: The components in the SMT assembly have a low rejection rate and higher vibration resistance. ③High reliability: Electronic products using SMT components have high frequencies...
Why does PCBA do testing and inspection method standards
Why
We know that no matter what product is produced, there will be a process before it leaves the factory, that is, inspection. Needless to say, the purpose of testing, I believe everyone will also understand, the following Sanjing will show you why PCBA testing is required.
(1) In order to improve the product qualification rate
With the improvement of product qualification rate, the straight-through rate of products will also be greatly improved. PCBA testing is an indispensable link in the entire production process of PCBA processing and an important means of controlling product quality.
(2) In order to obtain a better user experience
Generally speaking, if conditions permit, every product needs basic tests, such as ICT test, FCT test, aging test, fatigue test, stress test under harsh environment, aging test, etc. Because PCBA is...
See more information
We know that no matter what product is produced, there will be a process before it leaves the factory, that is, inspection. Needless to say, the purpose of testing, I believe everyone will also understand, the following Sanjing will show you why PCBA testing is required.
(1) In order to improve the product qualification rate
With the improvement of product qualification rate, the straight-through rate of products will also be greatly improved. PCBA testing is an indispensable link in the entire production process of PCBA processing and an important means of controlling product quality.
(2) In order to obtain a better user experience
Generally speaking, if conditions permit, every product needs basic tests, such as ICT test, FCT test, aging test, fatigue test, stress test under harsh environment, aging test, etc. Because PCBA is...
The purpose and precautions of PCBA rework
The
In PCBA processing plants, we often encounter some defective products or boards that need to be repaired when there are problems. So why do we need to pay attention to repairing or repairing? Let’s take a look at the following Sanjing:
Solder joint defects such as open circuits, bridges, false soldering and poor wetting generated in reflow soldering and wave soldering processes need to be manually trimmed and removed with the help of necessary tools (such as BGA rework station, X-Ray, high-power microscope, etc.) Various solder joint defects, so as to obtain qualified PCBA solder joints.
However, the solder joints to be repaired should be judged before repairing: ①The electronic product should be positioned before judging what solder joints need to be repaired. Determine which level of product the electronic product belongs to. If the product...
See more information
In PCBA processing plants, we often encounter some defective products or boards that need to be repaired when there are problems. So why do we need to pay attention to repairing or repairing? Let’s take a look at the following Sanjing:
Solder joint defects such as open circuits, bridges, false soldering and poor wetting generated in reflow soldering and wave soldering processes need to be manually trimmed and removed with the help of necessary tools (such as BGA rework station, X-Ray, high-power microscope, etc.) Various solder joint defects, so as to obtain qualified PCBA solder joints.
However, the solder joints to be repaired should be judged before repairing: ①The electronic product should be positioned before judging what solder joints need to be repaired. Determine which level of product the electronic product belongs to. If the product...
How to distinguish common SMT components
How
With the development of SMT chip technology towards miniaturization and high efficiency, various commonly used components are getting smaller and smaller. Therefore, the commonly used chip resistors, chip inductors, and chip capacitors have also become difficult to distinguish in appearance. So, how to distinguish the commonly used SMT components? Let’s take a look at the following Sanjing:
(1) The difference between chip inductance and chip resistance
1. Judging by the shape: the shape of the inductor is polygonal, and the resistance is basically rectangular. When the shape of the component to be distinguished has a polygonal shape, especially a circular shape, it is generally judged as an inductance.
2. Measure the resistance value: the resistance value of the inductor is relatively small, and the resistance value of the resistor is relatively large.
(2) The distinction between chip capacitors and chip resistors
1. Look at the color: chip capacitors are mostly gray, cyan, light yellow, and some have no printing on them, mainly because they are...
See more information
With the development of SMT chip technology towards miniaturization and high efficiency, various commonly used components are getting smaller and smaller. Therefore, the commonly used chip resistors, chip inductors, and chip capacitors have also become difficult to distinguish in appearance. So, how to distinguish the commonly used SMT components? Let’s take a look at the following Sanjing:
(1) The difference between chip inductance and chip resistance
1. Judging by the shape: the shape of the inductor is polygonal, and the resistance is basically rectangular. When the shape of the component to be distinguished has a polygonal shape, especially a circular shape, it is generally judged as an inductance.
2. Measure the resistance value: the resistance value of the inductor is relatively small, and the resistance value of the resistor is relatively large.
(2) The distinction between chip capacitors and chip resistors
1. Look at the color: chip capacitors are mostly gray, cyan, light yellow, and some have no printing on them, mainly because they are...
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