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Time of issue:2020-07-15 00:00:00
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Factors affecting the quality of SMT assembly products

  • Categories:FAQ
  • Author:SAJ
  • Origin:
  • Time of issue:2021-08-27
  • Views:0

(Summary description)As a key step in PCB assembly and manufacturing, SMT (Surface Mount Technology) has been widely used in the electronics manufacturing industry due to its advantages of saving materials, labor and time costs and high reliability. So far, SMT assembly has been used in all walks of life, including aerospace, medical care, electronic computers, electronic communications, automobiles, etc., greatly improving people's quality of life and the reliability of electronic products.
However, everything has two sides. Although SMT components drive electronic products with higher reliability and integrity, if problems occur during the assembly process, the quality of the final product will decrease. The following three crystals will introduce the factors that affect the quality of SMT assembly products:
The entire process of SMT assembly mainly includes solder paste printing, placement, soldering and inspection, which we will introduce in turn below.
Defects in the solder paste printing process. As the first step of the SMT assembly process, solder...

Factors affecting the quality of SMT assembly products

(Summary description)As a key step in PCB assembly and manufacturing, SMT (Surface Mount Technology) has been widely used in the electronics manufacturing industry due to its advantages of saving materials, labor and time costs and high reliability. So far, SMT assembly has been used in all walks of life, including aerospace, medical care, electronic computers, electronic communications, automobiles, etc., greatly improving people's quality of life and the reliability of electronic products.
However, everything has two sides. Although SMT components drive electronic products with higher reliability and integrity, if problems occur during the assembly process, the quality of the final product will decrease. The following three crystals will introduce the factors that affect the quality of SMT assembly products:
The entire process of SMT assembly mainly includes solder paste printing, placement, soldering and inspection, which we will introduce in turn below.
Defects in the solder paste printing process. As the first step of the SMT assembly process, solder...

  • Categories:FAQ
  • Author:SAJ
  • Origin:
  • Time of issue:2021-08-27
  • Views:0
Information

As a key step in PCB assembly and manufacturing, SMT (Surface Mount Technology) has been widely used in the electronics manufacturing industry due to its advantages of saving materials, labor and time costs and high reliability. So far, SMT assembly has been used in all walks of life, including aerospace, medical care, electronic computers, electronic communications, automobiles, etc., greatly improving people's quality of life and the reliability of electronic products.

 

However, everything has two sides. Although SMT components drive electronic products with higher reliability and integrity, if problems occur during the assembly process, the quality of the final product will decrease. The following three crystals will introduce the factors that affect the quality of SMT assembly products:

 

The entire process of SMT assembly mainly includes solder paste printing, placement, soldering and inspection, which we will introduce in turn below.

 

Defects in the solder paste printing process. As the first step of the SMT assembly process, solder paste printing plays a decisive role in determining the quality of the PCB and the final product. If there is no strict control during solder paste printing, it may cause solder balls in the subsequent SMT assembly process. For example, non-wetting will cause the metal particles to be oxidized. If the solder paste is insufficient, the metal particles will also be affected by irregular shapes, so solder balls are prone to occur.

 

 

Defects during placement. Placement, also called chip mounting, is the most complicated manufacturing step for SMT assembly. The quality of chip mounting represents the manufacturing level of SMT and the final performance of the product, so most of the defects are produced in this step. Due to poor execution, missing components may occur, and if the component supplier makes an error, it may cause incorrect positioning of the component, resulting in misalignment.

 

Defects in the welding process. Soldering refers to the process in which the device is adhered to the PCB board, by melting the metal solder, cooling it, and hardening when the device is completely adhered on the PCB board. The soldering step also greatly affects the performance of electronic products, so the improvement of soldering quality lays the foundation for product performance assurance. During the whole welding process, all welding factors must be considered, including the cleanliness of the board surface, welding temperature and welding quality.

 

In reflow soldering, the most likely top defect is solder balls, followed by small metal particles caused by soldering on the surface of the component. The solder balls may short-circuit the IC and cause the assembly circuit to fail. In addition, if the smaller PCB must be soldered twice, if the solder balls roll, the entire circuit board may be short-circuited or even burned.

 

In addition to the above factors affecting product quality during the SMT assembly process, insufficient cleaning can also lead to degradation of PCB quality.

 

The above is about the factors that affect the quality of SMT assembly products, I hope it can be helpful to everyone!

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