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Time of issue:2020-07-15 00:00:00
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Switch pcba tells: the various aspects of the circuit board!
Switch
Signal layer: Mainly used to place components or wiring. Protel DXP usually contains 30 middle layers, namely Mid Layer1~Mid Layer30. The middle layer is used to arrange signal lines, and the top and bottom layers are used to place components or deposit copper.
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Signal layer: Mainly used to place components or wiring. Protel DXP usually contains 30 middle layers, namely Mid Layer1~Mid Layer30. The middle layer is used to arrange signal lines, and the top and bottom layers are used to place components or deposit copper.
Precautions for PCBA Sub-board Process
Precautions
Generally speaking, after the PCBA assembly process is completed, the PCBA panels need to be separated. Because some PCB boards are small in size, they are usually made into the form of paneling. However, pay special attention when splitting the board. If you are not careful, it is easy to damage the intact PCBA board. There are two ways to split the board: one is manual splitting; the other is machine splitting. There are different ways of dividing the board, and the matters needing attention are also different. The following Sanjing will take you to understand:
(1) Manual sub-board
When folding the edge of the board, you must hold the lower edge of the PCBA board with both hands, try to avoid bending...
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Generally speaking, after the PCBA assembly process is completed, the PCBA panels need to be separated. Because some PCB boards are small in size, they are usually made into the form of paneling. However, pay special attention when splitting the board. If you are not careful, it is easy to damage the intact PCBA board. There are two ways to split the board: one is manual splitting; the other is machine splitting. There are different ways of dividing the board, and the matters needing attention are also different. The following Sanjing will take you to understand:
(1) Manual sub-board
When folding the edge of the board, you must hold the lower edge of the PCBA board with both hands, try to avoid bending...
What are the precautions when making SMT steel mesh
What
In the SMT process, stencil production is an indispensable step, and it also plays a vital role, because it determines whether the tin on each pad is uniform and full, which affects the reflow of SMT components after mounting Welding reliability after welding.
Generally speaking, it is necessary to carefully analyze the characteristics of each PCB to develop steel mesh. For circuit boards with high-precision quality requirements, laser steel mesh must be used, and SMT engineers are required to confirm the process flow, and adjust the aperture of the opening appropriately to ensure Tin effect. However, there are some things to pay attention to when making steel mesh. The following Sanjing will take you to understand:
①ME requires the supplier to make steel mesh according to the relevant documents and materials provided by the engineering department.
②The frame size requirements of the steel mesh, such as 550mm*650mm, 370mm*470mm, are mainly determined...
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In the SMT process, stencil production is an indispensable step, and it also plays a vital role, because it determines whether the tin on each pad is uniform and full, which affects the reflow of SMT components after mounting Welding reliability after welding.
Generally speaking, it is necessary to carefully analyze the characteristics of each PCB to develop steel mesh. For circuit boards with high-precision quality requirements, laser steel mesh must be used, and SMT engineers are required to confirm the process flow, and adjust the aperture of the opening appropriately to ensure Tin effect. However, there are some things to pay attention to when making steel mesh. The following Sanjing will take you to understand:
①ME requires the supplier to make steel mesh according to the relevant documents and materials provided by the engineering department.
②The frame size requirements of the steel mesh, such as 550mm*650mm, 370mm*470mm, are mainly determined...
How to control the quality of PCBA processing
How
We know that the process of PCBA processing is very cumbersome, no matter which part of the problem occurs, it will lead to poor product processing. So how to control the quality of PCBA processing? Let’s take a look at the following Sanjing:
Quality control is an important step to ensure product quality and production efficiency, so the most important thing is to establish a complete quality management system (ISO). Take reflow soldering as an example. Although the temperature in the furnace can be controlled by the furnace temperature control system and temperature sensor in the reflow soldering, the actual temperature of the solder joints on the PCB is not necessarily equal to the preset temperature of the reflow soldering. Although the reflow soldering machine works normally and the temperature control is...
See more information
We know that the process of PCBA processing is very cumbersome, no matter which part of the problem occurs, it will lead to poor product processing. So how to control the quality of PCBA processing? Let’s take a look at the following Sanjing:
Quality control is an important step to ensure product quality and production efficiency, so the most important thing is to establish a complete quality management system (ISO). Take reflow soldering as an example. Although the temperature in the furnace can be controlled by the furnace temperature control system and temperature sensor in the reflow soldering, the actual temperature of the solder joints on the PCB is not necessarily equal to the preset temperature of the reflow soldering. Although the reflow soldering machine works normally and the temperature control is...
PCBA production stage and testing method
PCBA
As we all know, after PCBA production is completed, product inspection is required. There are many inspection methods, but each inspection method has its own advantages and disadvantages. Therefore, it is particularly important to choose a suitable inspection method.
PCBA production is generally divided into three stages: new product prototype manufacturing, trial production, and mass production. Corresponding inspection programs should be set up at each stage. The following Sanjing will take you to understand:
(1) New product prototype manufacturing: New product prototype testing is generally adjusted in conjunction with process parameters, and planning for timeliness, reliability, and economy. The main detection methods are: ① Solder paste coating inspection...
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As we all know, after PCBA production is completed, product inspection is required. There are many inspection methods, but each inspection method has its own advantages and disadvantages. Therefore, it is particularly important to choose a suitable inspection method.
PCBA production is generally divided into three stages: new product prototype manufacturing, trial production, and mass production. Corresponding inspection programs should be set up at each stage. The following Sanjing will take you to understand:
(1) New product prototype manufacturing: New product prototype testing is generally adjusted in conjunction with process parameters, and planning for timeliness, reliability, and economy. The main detection methods are: ① Solder paste coating inspection...
Types of residues on PCBA
Types
With the development of the electronic information industry, PCBA assembly process requirements are getting higher and higher, and the quality and reliability of electronic products depend on the quality and reliability of PCBA. However, from the process practice and PCBA failure analysis, it is known that the quality and reliability of PCBA are also affected by many factors, such as welding residue. The following Sanjing will introduce you:
During the soldering process, the residues are generally flux residues, by-products of the reaction between flux and solder, adhesives, lubricating oil, etc., or other relatively small potential hazards such as contaminants carried in the production and transportation of PCB components. These residues are generally divided into three types: one is non-polar residues, mainly including rosin, resin, adhesives, lubricating oil, etc. These residues are generally cleaned with non-polar cleaning solvents to be better removed; the second type It is a polar residue, also called an ionic residue, which mainly...
See more information
With the development of the electronic information industry, PCBA assembly process requirements are getting higher and higher, and the quality and reliability of electronic products depend on the quality and reliability of PCBA. However, from the process practice and PCBA failure analysis, it is known that the quality and reliability of PCBA are also affected by many factors, such as welding residue. The following Sanjing will introduce you:
During the soldering process, the residues are generally flux residues, by-products of the reaction between flux and solder, adhesives, lubricating oil, etc., or other relatively small potential hazards such as contaminants carried in the production and transportation of PCB components. These residues are generally divided into three types: one is non-polar residues, mainly including rosin, resin, adhesives, lubricating oil, etc. These residues are generally cleaned with non-polar cleaning solvents to be better removed; the second type It is a polar residue, also called an ionic residue, which mainly...
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