With the development of modern science and technology, automation equipment has become the protagonist in the manufacturing field. For example, SMT manufacturing uses high-speed, high-precision fully automated equipment. Therefore, this requires higher and higher PCB design requirements.

We know that the quality of SMT manufacturing depends on SMT technology, and the key link in SMT technology is PCB design. If PCB design cannot meet the requirements of SMT equipment, it will affect production efficiency and quality. The following Sanjing will show you what are the requirements of SMT manufacturing equipment for PCB design:

The PCB design requirements of SMT manufacturing equipment mainly include: PCB pattern, PCB size and positioning hole, PCB blanking, MARK mark, etc. The following Sanjing will introduce you in turn.

PCB pattern: In the SMT automatic production line, PCB production starts from the loader and completes the production after printing, chip mounting and soldering. In this process, the PCB is transmitted on the device path, and the PCB pattern is required to be consistent with the device transmission path.

PCB size: PCB design size must meet the maximum and minimum size requirements of the placement machine. So far, the size of most equipment is in the range of 50mm×50mm~330mm×250mm (or 410mm×360mm). If the PCB thickness is too thin, the design size should not be too large, otherwise the reflow temperature will cause PCB deformation. The ideal aspect ratio is 3:2 or 4:3. If the PCB size is smaller than the minimum size requirement of the device, it needs to be assembled, and the number of panels depends on the size and thickness of the PCB.

PCB positioning holes: SMT positioning methods generally have two types, positioning holes and edge positions. However, the more commonly used positioning method is the MARK marking method.

PCB blanking: Since the PCB is transmitted on the device path, the component cannot be placed along the clamping edge direction, otherwise the component will be squeezed by the device, which will affect the chip installation.

PCB Marking: Marking points for all automatic equipment markings and positions, mainly used to correct PCB manufacturing errors. Its surface is the same as the soldering plane of the PCB pad. If the soldering surface is uniform, the reflection effect is excellent. The size of the logo must be within the range of 0.5~3mm, and the shape is generally square, cross, solid circle/hollow circle, triangle, rhombus, ellipse, etc. Generally, solid circles are used more often, with a diameter of 1mm.

The above are the PCB design elements that affect SMT manufacturing, I hope it can be helpful to everyone!