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PCBA production stage and testing method

  • Categories:FAQ
  • Author:SAJ
  • Origin:
  • Time of issue:2021-09-08
  • Views:0

(Summary description)As we all know, after PCBA production is completed, product inspection is required. There are many inspection methods, but each inspection method has its own advantages and disadvantages. Therefore, it is particularly important to choose a suitable inspection method.
PCBA production is generally divided into three stages: new product prototype manufacturing, trial production, and mass production. Corresponding inspection programs should be set up at each stage. The following Sanjing will take you to understand:
(1) New product prototype manufacturing: New product prototype testing is generally adjusted in conjunction with process parameters, and planning for timeliness, reliability, and economy. The main detection methods are: ① Solder paste coating inspection...

PCBA production stage and testing method

(Summary description)As we all know, after PCBA production is completed, product inspection is required. There are many inspection methods, but each inspection method has its own advantages and disadvantages. Therefore, it is particularly important to choose a suitable inspection method.
PCBA production is generally divided into three stages: new product prototype manufacturing, trial production, and mass production. Corresponding inspection programs should be set up at each stage. The following Sanjing will take you to understand:
(1) New product prototype manufacturing: New product prototype testing is generally adjusted in conjunction with process parameters, and planning for timeliness, reliability, and economy. The main detection methods are: ① Solder paste coating inspection...

  • Categories:FAQ
  • Author:SAJ
  • Origin:
  • Time of issue:2021-09-08
  • Views:0
Information

As we all know, after PCBA production is completed, product inspection is required. There are many inspection methods, but each inspection method has its own advantages and disadvantages. Therefore, it is particularly important to choose a suitable inspection method.

 

PCBA production is generally divided into three stages: new product prototype manufacturing, trial production, and mass production. Corresponding inspection programs should be set up at each stage. The following Sanjing will take you to understand:

 

(1) New product prototype manufacturing: New product prototype testing is generally adjusted in conjunction with process parameters, and planning for timeliness, reliability, and economy. The main detection methods are: ① Solder paste coating inspection (SPI): Use a 3D solder paste detector to detect all or key solder paste coating points (such as fine pitch, ultra-fine pitch devices, etc.), and extract and record solder paste parameters value. Generally, when the time is tight, it is allowed to use visual inspection instead of SPI inspection equipment inspection.

 

②Flying probe inspection: Generally, the production quantity of prototype products is limited, and the time requirements are relatively strict, while the flying probe online detector does not need to make needle beds, fixtures, etc., which saves a lot of work and time in this link. Generally, PCB design can be received through the system The data automatically generates the corresponding inspection program, which is more suitable for inspection after assembly and welding.

 

 

③Functional testing: Functional testing is mainly to test product design indicators and debug, which can find problems such as component failures and rationality of electrical principle design.

 

For prototype production of packaged device products such as BGA and flip chip, if conditions permit, the solder joints or key solder joints of this type of device should be tested with the X-RAY detector before flying probe testing to ensure that the solder joints are internal quality.

 

(2) Trial production: The main purpose of the trial production is to verify the stability of the process parameters, so the testing of the trial production and the testing of the prototype product can be used in common.

 

(3) Mass production: Mass production is generally divided into large, medium, and small, but there is no precise regulation on the specific number of divisions. Among them, mass production is the most economical production mode. Generally, automatic inspection equipment is used to replace manual inspection after all preparations for assembly production are completed. In addition to better monitoring of product assembly quality, it can also improve inspection efficiency. In addition, if there is no production of products assembled with packaged devices such as BGA, flip-chip, etc., AOI testing can be used instead of X-RAY testing to save testing costs.

 

Medium and small batch production: The production cycle of small and medium batch products is short. The inspection plan generally starts from reliability and economy, and considers two categories of general component assembly products and special packaged device assembly products.

 

The above is about the PCBA production stage and testing methods, I hope it can be helpful to everyone!

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