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Time of issue:2020-07-15 00:00:00
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SMT贴片机的发展方向及趋势

(Summary description)With the rapid development of SMT, the size of components has become smaller and smaller, the density of SMT patches has become higher and higher, and many new packaging forms have been continuously introduced. In order to meet the needs of high-density and difficult SMT patch processing and assembly technology, SMT placement machines are developing in the direction of high speed, multi-function, modularization and intelligence.
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...

SMT贴片机的发展方向及趋势

(Summary description)With the rapid development of SMT, the size of components has become smaller and smaller, the density of SMT patches has become higher and higher, and many new packaging forms have been continuously introduced. In order to meet the needs of high-density and difficult SMT patch processing and assembly technology, SMT placement machines are developing in the direction of high speed, multi-function, modularization and intelligence.
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...

Information

With the rapid development of SMT, the size of components has become smaller and smaller, the density of SMT patches has become higher and higher, and many new packaging forms have been continuously introduced. In order to meet the needs of high-density and difficult SMT patch processing and assembly technology, SMT placement machines are developing in the direction of high speed, multi-function, modularization and intelligence.

 

The following Sanjing will take you to understand the development direction of SMT placement machines:

 

(1) High precision

 

In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:

 

①Improve the SMT placement machine vision system, use a high-resolution linear scan camera, and perform gray-scale processing on the image to improve the accuracy of image processing and further improve the accuracy level of the SMT placement machine.

 

②The intelligent service system is adopted to improve service performance and quick-break adjustment time, reduce the load of the host, and improve the reliability of SMT placement.

 

③Using a high-resolution linear encoder closed-loop system.

 

④The temperature compensation function is adopted to reduce the environmental impact on SMT processing and placement of ultra-fine-pitch ICs.

 

 

(2) High speed

 

Using flying centering technology, the CCD image sensor is directly mounted on the placement head, and after the device is picked up, the components are optically centered during the process of SMT placement and processing of the printed circuit board placement position.

 

(3) Modularization of high-speed SMT placement area

 

①Dual-way conveying structure: While retaining the performance of the traditional single-way placement machine, the transportation, positioning and inspection of the printed circuit board for SMT patch processing are designed into a dual-path structure. The SMT patch processing and placement machine with this structure has The working mode can be divided into synchronous and asynchronous. During synchronous operation, another printed board completes the steps of transmission, fiducial alignment, and bad board inspection, which can improve the work efficiency of the SMT chip processing plant.

 

②Automatic nozzle conversion function: Some foreign companies have made improvements to the placement head of the new SMT placement machine, such as the use of turntable and double nozzle structure. The turntable structure automatically replaces the required suction nozzles during the movement of the placement head, and can pick up multiple components at the same time in a pick and place process, reducing the number of times the placement arm moves back and forth, thereby improving the work efficiency of the SMT placement machine.

 

The above is about the development direction and trend content of SMT placement machine, I hope it can be helpful to everyone!

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