Each process of SMT patch processing is very complicated and cumbersome, and problems may occur in each link. Once a problem occurs in a certain link, the impact on the latter is continuous. In order to improve product quality and ensure product quality is qualified, it is necessary to use various testing equipment for testing. Next, let's take a look at what are the common testing equipment? What are their functions?

1. MVI (Machine Vision)

It is a high-speed, high-precision optical image inspection system that uses machine vision as the standard technology for inspection. It is an effective inspection method for industrial automation. It uses optical methods to obtain the surface state of the finished product and uses image processing to detect foreign objects or patterns. Defects such as abnormalities. Because it is a non-contact inspection, semi-finished products can be inspected in the middle. It can improve the shortcomings of traditional manual optical instruments for detection.

2. AOI testing equipment

Where AOI inspection equipment is used: AOI can be used in multiple positions on the production line, and each position can detect special defects, but AOI inspection equipment should be placed in a position that can identify and correct most defects as soon as possible. AOI detection is usually available after the PCB board etching process, which is mainly used to find the missing and redundant parts in the X-ray detector.

Three, X-ray detector

Where the X-ray detector is used: It can detect all solder joints on the circuit board, including solder joints that are invisible to the naked eye. Defects that can be detected by X-ray detectors mainly include post-welded bridges, cavities, too many solder joints, and too small solder joints.

4. ICT testing equipment

The use of ICT: ICT is oriented to production process control, and resistance, capacitance, inductance, and integrated circuits can be measured. It is especially suitable for detecting open circuit, short circuit and component damage, accurate fault location and convenient maintenance. ICT can detect defects such as virtual welding, open circuit, short circuit, component failure, and material error after welding.