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Time of issue:2020-07-15 00:00:00
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SMT patch processing production process and introduction

(Summary description)The first step is solder paste printing. The function of solder paste printing is to leak the solder paste onto the PCB pads to prepare for the soldering of components. The equipment used for printing is a screen printing machine, located at the forefront of the SMT production line.
The second step is the placement of parts. Its function is to accurately install the surface mount components to the fixed position of the PCB. The equipment used for placement is an SMT placement machine, which is located behind the screen printing machine in the SMT production line.
The third step is curing through the oven. Its function is to melt the patch glue, so that the surface mount components and the PCB board are...

SMT patch processing production process and introduction

(Summary description)The first step is solder paste printing. The function of solder paste printing is to leak the solder paste onto the PCB pads to prepare for the soldering of components. The equipment used for printing is a screen printing machine, located at the forefront of the SMT production line.
The second step is the placement of parts. Its function is to accurately install the surface mount components to the fixed position of the PCB. The equipment used for placement is an SMT placement machine, which is located behind the screen printing machine in the SMT production line.
The third step is curing through the oven. Its function is to melt the patch glue, so that the surface mount components and the PCB board are...

Information

The first step is solder paste printing. The function of solder paste printing is to leak the solder paste onto the PCB pads to prepare for the soldering of components. The equipment used for printing is a screen printing machine, located at the forefront of the SMT production line.

 

The second step is the placement of parts. Its function is to accurately install the surface mount components to the fixed position of the PCB. The equipment used for placement is an SMT placement machine, which is located behind the screen printing machine in the SMT production line.

 

The third step is curing through the oven. Its function is to melt the patch glue, so that the surface mount components and the PCB board are firmly bonded together. The equipment used for curing is a curing oven, which is located behind the placement machine in the SMT production line.

 

 

The fourth step is reflow soldering. Its function is to melt the solder paste, so that the surface mount components and the PCB board are firmly bonded together. The equipment used for soldering is a reflow oven, located behind the placement machine in the SMT production line.

 

The fifth step is AOI optical inspection. Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The inspection equipment is automatic optical inspection (AOI). Generally, the inspection quantity is used in the case of tens of thousands. If the inspection quantity is small, the inspection is carried out manually. Its placement position in the production line can be selected according to the needs of the inspection. For example, some are before reflow soldering, and some are after reflow soldering.

 

The last step is repair, which is mainly to repair the PCB board that has failed. The main tool used in maintenance is a soldering iron. Usually this process is configured after AOI optical inspection.

 

The above is the production process and introduction of SMT patch processing, I hope it can be helpful to everyone! For more information, please go to the official website of Sanjing (http://www.sajpcba.cn) to view.

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