Nowadays, with the rapid development of social science and technology, automated mechanized equipment has become the main production force of factories and enterprises. They save manpower while also greatly improving production efficiency. However, each production line is subdivided into many workflows. Today, I will mainly introduce the workflow of SMT solder paste printing machine:

1. Preparation before starting production

1. Preparation of the template

(1) The thickness of the template substrate and the size of the window are directly related to the quality of the solder paste printing, thereby affecting the quality of the next SMT patch. The template should have the characteristics of abrasion resistance, pores, burrs and serrations, smooth hole walls, good solder paste permeability, small stretch of the screen and good resilience.

(2) Move the screen frame support plate according to the size of the screen frame, align the center of the screen frame in the front, back, left and right directions with the front beam of the printing press and the scale "0" on the left and right support plates, and place it in the center. Lock the screen tightly.

Second, the operating process of the solder paste printing machine

1. Check before starting

① Check whether the voltage of the input power supply and the air pressure of the air source meet the requirements. ②Check whether the wiring of the machine is well connected. ③Check whether the equipment is well grounded. ④Check whether the pneumatic system is leaking, whether there is water in the air input filter device, and whether it is working properly. ⑤Check if the tightness of each conveyor belt of the machine is appropriate. ⑥Check whether there are irrelevant debris left in the electric control box, and whether the wiring sockets in the electric control box are well plugged in. ⑦Check whether there are tools and other objects left inside the machine. ⑧According to the requirements of the PCB to be printed, prepare the corresponding screen and solder paste. ⑨Check whether the magnetic thimble and vacuum chuck are placed on the worktable according to the size of the PCB to be produced. ⑩Check if the cleaning roll paper is installed, check the air pressure and liquid level in the alcohol tank (the pressure in the alcohol tank should be 1~2kgc㎡, and the liquid level should exceed the liquid level sensor). ⑪Check whether the emergency brake switch of the machine pops up. ⑫Check whether the three-color light is working properly, and check whether the front and rear covers of the machine are properly closed.

Three, the operation process of SMT solder paste printing machine

Mainly include: PCB board, solder paste printing, PCB board three parts, the specific workflow is as follows: the printer receives the PCB from the Loader → the camera recognizes and locates → the vacuum or clamping device fixes the PCB → the lifting device lifts the PCB into contact The stencil → the squeegee drops to the SMT printing position → the squeegee starts printing according to the setting → the squeegee returns to the original position after printing is completed → the PCB and the stencil start to separate → the printing effect 2D inspection → send out the PCB → carry out the stencil cleaning → the printing is completed and proceed to the next A printing action.

Fourth, the general working steps of the solder paste printing machine:

①The PCB circuit board is sent to the solder paste printer along the conveyor belt. ②The machine looks for the main side of the PCB and locates it. ③The Z frame moves up to the position of the vacuum plate. ④Add a vacuum to firmly fix the PCB in a specific position. ⑤The vision axis (lens) slowly moves to the first target (reference point) of the PCB. ⑥The visual axis (lens) looks for the target (reference point) under the corresponding steel mesh. ⑦The machine moves the printing screen to align it with the PCB. The machine can move the printing screen in the X and Y axis directions and rotate in the θ axis direction. ⑧ Align the steel mesh with the PCB, the Z-shaped frame will move upward, driving the PCB to contact the bottom of the printing mesh. ⑨Once moved into place, the squeegee will push the solder paste to roll on the stencil, and print it on the PAD position of the PCB through the holes in the stencil. ⑩When the printing is completed, the Z-shaped frame moves downward to drive the PCB and the steel mesh to separate. ⑪The machine will send out the PCB to the next process. ⑫The printing machine is required to receive the next PCB product to be printed. ⑬ Perform the same process, but use the second squeegee to print in the opposite direction.

Okay, the above is the whole work flow of the SMT solder paste printing machine, do you understand it?