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Time of issue:2020-07-15 00:00:00
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SMT surface assembly board cleaning process after welding

(Summary description)When it comes to SMT surface cleaning process, it is generally organic solvent cleaning or ultrasonic cleaning. Because of its high cleaning efficiency, it is widely used in SMT chip processing. The following Sanjing will share with you the difference between the two:
Organic solvent cleaning: Use organic solvents for cleaning and rinsing. After cleaning, the organic solvent on the surface of the workpiece evaporates quickly, and no drying process is required. The cleaning principle is mainly to dissolve. This method is suitable for cleaning printed circuit boards that are...

SMT surface assembly board cleaning process after welding

(Summary description)When it comes to SMT surface cleaning process, it is generally organic solvent cleaning or ultrasonic cleaning. Because of its high cleaning efficiency, it is widely used in SMT chip processing. The following Sanjing will share with you the difference between the two:
Organic solvent cleaning: Use organic solvents for cleaning and rinsing. After cleaning, the organic solvent on the surface of the workpiece evaporates quickly, and no drying process is required. The cleaning principle is mainly to dissolve. This method is suitable for cleaning printed circuit boards that are...

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When it comes to SMT surface cleaning process, it is generally organic solvent cleaning or ultrasonic cleaning. Because of its high cleaning efficiency, it is widely used in SMT chip processing. The following Sanjing will share with you the difference between the two:

 

Organic solvent cleaning: Use organic solvents for cleaning and rinsing. After cleaning, the organic solvent on the surface of the workpiece evaporates quickly, and no drying process is required. The cleaning principle is mainly to dissolve. This method is suitable for cleaning printed circuit boards that are sensitive to water and whose components are poorly sealed.

 

Ultrasonic cleaning: Ultrasonic technology can clean contaminants at the bottom of components, between components and in small gaps, and is suitable for post-welding cleaning of high-density, narrow-pitch, and surface-mounted SMT boards with serious pollution. Ultrasonic vibration will produce a large impact and has a certain ability to penetrate components. It can penetrate the layers of the packaging material to block access to the inside of the device and damage the internal connection of the IC. It is generally not recommended for military products. use. Here, by the way, introduce the principle of ultrasonic cleaning:

 

 

The cleaning agent is formed under the action of ultrasound to produce a pore structure and diffusion effect. The cavity structure will produce a strong impact force, which can clean up the contaminants attached to the surface; ultrasonic vibration can cause the liquid particles in the cleaning agent to diffuse and accelerate the speed of the cleaning agent to dissolve the contaminants. In addition, the number of holes, the size of the holes and the strength of the cleaning agent vibration during ultrasonic cleaning are related to the vibration power and frequency of the piezoelectric vibrator. The greater the density and size of the holes, the higher the cleaning efficiency.

 

Finally, I would like to introduce to you the selection conditions of the cleaning agent:

 

1. It has good wettability, so that オ can fully wet and dissolve the contaminants on the surface during SMT patch processing.

2. Moderate capillary action, low viscosity, can penetrate into the gaps of the circuit board components to be washed, and easy to discharge.

3. The high density can slow down the volatilization rate of the solvent.

4. High boiling point is conducive to vapor condensation. A cleaning agent with a high boiling point is safe, and at the same time, the cleaning efficiency can be improved by continuously increasing the temperature.

5. Solubility. Solubility is also called kauri butanol value (kauri butanol, KB value), which is a characteristic parameter of solvents that dissolve pollutants. The larger the KB value, the stronger the ability to dissolve organic pollutants.

6. Less corrosive. After cleaning, the characters and marks on the surface of the components and the printed circuit board can be kept clear.

7. Good safety, non-toxic and harmless, non-flammable and explosive.

8. Low cost and less environmental pollution.

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