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Time of issue:2020-07-15 00:00:00
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The development trend of Pcba?

(Summary description)Vigorously develop high-density interconnection technology (HDI)-HDI embodies contemporary PCBA technology, which brings fine wire and micro-aperture to PCBA.

The development trend of Pcba?

(Summary description)Vigorously develop high-density interconnection technology (HDI)-HDI embodies contemporary PCBA technology, which brings fine wire and micro-aperture to PCBA.

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Do you know the development trend of Pcba? Follow the editor to have a simple understanding!
1. Vigorously develop high-density interconnection technology (HDI) ─ HDI embodies contemporary Pcba technology, which brings fine wire and micro-aperture to Pcba.
2. Component embedding technology with strong vitality ─ Component embedding technology is a huge change in Pcba functional integrated circuits. Pcba manufacturers must increase resource investment in systems including design, equipment, testing, and simulation to maintain strong vitality.


3. Pcba materials conforming to international standards-high heat resistance, high glass transition temperature (Tg), small thermal expansion coefficient, and small dielectric constant.
4. Optoelectronic Pcba has a broad prospect-it uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as lithography, laser ablation, and reactive ion etching.
5. Update the manufacturing process and introduce production equipment.
In summary, it is a brief introduction to relevant knowledge about the development trend of Pcba.

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