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Time of issue:2020-07-15 00:00:00
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The difference between PCBA processing reflow soldering and wave soldering

(Summary description)In PCBA processing, the two most common soldering methods are reflow soldering and wave soldering. So what exactly are they? What is the role of each? Let's take a brief look at the following Sanjing belts.
First, let's take a look at reflow soldering. Reflow soldering refers to the electrical interconnection of the pins or solder ends of the electronic components pre-mounted on the pads with the pads on the PCB by heating and melting the solder paste pre-coated on the pads to achieve the electronic The purpose of soldering components on the PCB board. Reflow soldering is generally divided into three parts: preheating zone, heating zone and cooling zone.
Reflow soldering process:...

The difference between PCBA processing reflow soldering and wave soldering

(Summary description)In PCBA processing, the two most common soldering methods are reflow soldering and wave soldering. So what exactly are they? What is the role of each? Let's take a brief look at the following Sanjing belts.
First, let's take a look at reflow soldering. Reflow soldering refers to the electrical interconnection of the pins or solder ends of the electronic components pre-mounted on the pads with the pads on the PCB by heating and melting the solder paste pre-coated on the pads to achieve the electronic The purpose of soldering components on the PCB board. Reflow soldering is generally divided into three parts: preheating zone, heating zone and cooling zone.
Reflow soldering process:...

Information

In PCBA processing, the two most common soldering methods are reflow soldering and wave soldering. So what exactly are they? What is the role of each? Let's take a brief look at the following Sanjing belts.

 

First, let's take a look at reflow soldering. Reflow soldering refers to the electrical interconnection of the pins or solder ends of the electronic components pre-mounted on the pads with the pads on the PCB by heating and melting the solder paste pre-coated on the pads to achieve the electronic The purpose of soldering components on the PCB board. Reflow soldering is generally divided into three parts: preheating zone, heating zone and cooling zone.

 

Reflow soldering process: printing solder paste → mounting components → reflow soldering → cleaning.

 

Next, let's take a look at wave soldering. Wave soldering is to use a pump to spray the molten solder into a solder wave, and then pass the pins of the electronic components that need to be soldered through the solder wave to realize the electrical interconnection between the electronic components and the PCB board. Wave soldering is divided into four parts: spraying, preheating, tin furnace, and cooling.

 

 

Wave soldering process: plug-in → applying flux → preheating → wave soldering → cutting corners → inspection.

 

Well, the two soldering methods of reflow soldering and wave soldering are introduced here first. Let's take a look at the difference between them.

 

1. Reflow soldering is a process where high-temperature hot air forms reflow melting solder to solder components; while wave soldering is where molten solder forms a peak of solder to solder components.

 

2. During reflow soldering, there is already solder in front of the PCB on the furnace. After soldering, the coated tin paste is only melted for soldering; during wave soldering, there is no solder in front of the PCB on the furnace, and the solder wave generated by the soldering machine coats the solder. Complete the soldering on the pads that need to be soldered.

 

3. Reflow soldering is suitable for SMD electronic components, and wave soldering is suitable for pin electronic components.

 

The above is about the difference between PCBA processing reflow soldering and wave soldering, I hope it can be helpful to everyone!

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