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Time of issue:2020-07-15 00:00:00
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The difference between SMT assembly and THT assembly

(Summary description)With the rapid development of electronic technology, electronic products are becoming more and more miniaturized, and their weight and cost are therefore reduced. As far as SMT is concerned, SMC is mainly soldered to PCB by reflow soldering. Reflow soldering is carried out in a reflow oven. Although SMT components adhere to a high degree of automation, manual soldering is still very important in its manufacturing process.
Let's first understand the advantages of SMT assembly:
(1) High assembly density. Compared with traditional through-hole components, chip components require smaller circuit board space. The application of SMT components reduces the volume of electronic products by 60% and the weight by 75%.
(2) High reliability. The chip components are small in size, light in weight, and have high reliability...

The difference between SMT assembly and THT assembly

(Summary description)With the rapid development of electronic technology, electronic products are becoming more and more miniaturized, and their weight and cost are therefore reduced. As far as SMT is concerned, SMC is mainly soldered to PCB by reflow soldering. Reflow soldering is carried out in a reflow oven. Although SMT components adhere to a high degree of automation, manual soldering is still very important in its manufacturing process.
Let's first understand the advantages of SMT assembly:
(1) High assembly density. Compared with traditional through-hole components, chip components require smaller circuit board space. The application of SMT components reduces the volume of electronic products by 60% and the weight by 75%.
(2) High reliability. The chip components are small in size, light in weight, and have high reliability...

Information

With the rapid development of electronic technology, electronic products are becoming more and more miniaturized, and their weight and cost are therefore reduced. As far as SMT is concerned, SMC is mainly soldered to PCB by reflow soldering. Reflow soldering is carried out in a reflow oven. Although SMT components adhere to a high degree of automation, manual soldering is still very important in its manufacturing process.

 

Let's first understand the advantages of SMT assembly:

 

(1) High assembly density. Compared with traditional through-hole components, chip components require smaller circuit board space. The application of SMT components reduces the volume of electronic products by 60% and the weight by 75%.

 

(2) High reliability. The chip components are small in size, light in weight, and have high reliability and impact resistance. Using automated production, welding and placement are more reliable.

 

(3) High frequency. Since chip components do not contain leads, parasitic inductance and capacitance will decrease as the frequency increases.

 

(4) Low cost. Due to the rapid development and wide application of chip components, the cost of chip components is also declining. SMT assembly simplifies the entire manufacturing process and reduces manufacturing costs. As far as SMC is concerned, the lead does not need to be reorganized, bent or cut, thereby shortening the entire production process and improving production efficiency.

 

 

The difference between SMT and THT stems from the difference in component types, including component structure and lead type. Since SMT manufacturing mainly uses lead-free or short-lead components, the essential difference is that the components are fixed on the PCB in different ways.

 

The basic requirements for manual soldering of SMT components: ①Use a thinner tin wire with a diameter between 0.5 and 0.6mm. You can also use a no-clean flux solder paste, which is low corrosive and has no residue; ②Use a constant temperature soldering iron and special tweezers , The power of the constant temperature soldering iron should be less than 20W; ③The operator needs to be proficient in SMT inspection and welding technology, and strictly implement the SMT assembly operating procedures.

 

Commonly used tools and equipment for SMC manual welding: ①Tweezers, which are special welding tools for SMC; ②Constant temperature soldering iron: constant heating, saving electric energy, can make the temperature rise rapidly; ③Soldering iron special heating head: different sizes of soldering iron heating heads can be Solder many SMCs to PCBs with different pin counts, including QFPs, diodes, transistors and ICs; ④Vacuum suction gun: mainly composed of suction gun and vacuum pump, the front of the suction gun is a hollow soldering head, which can be heated; ⑤Hot-air soldering station: As a semi-automatic equipment, using hot air as the heat source, the hot-air soldering station can easily weld SMC, and it can also weld various types of components, which is more convenient than a soldering iron.

 

SMC manual soldering techniques: ①First solder the tin on the pad, close the soldering iron to the pad to keep the tin melted, then use tweezers to put the component on the pad for terminal soldering; ②Place the IC on the corresponding position and apply The solder paste fixes the leads on the IC so that the chip can be fixed accurately; ③The IC can be soldered by a hot-air soldering station, but the solder paste should be used as solder instead of tin wire. The solder paste can be manually applied to the pads first. After placing the SMC, use a hot air nozzle to quickly move along the chip so that all the pads can be smoothly heated after the soldering is completed.

 

In summary, in the electronics manufacturing industry, manual welding is a traditional welding method. No matter how the technology develops, the combination of automatic welding and manual welding can make the electronics manufacturing exert a more positive influence.

 

The above is about the difference between SMT assembly and THT assembly, I hope it can be helpful to everyone!

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