With the application and development of electronic technology in modern society, SMT (Surface Mount Technology) is becoming more and more popular because of its small assembly volume and high work efficiency. However, SMT and SMD are often confused, and sometimes they can be used interchangeably. The following Sanjing will show you the difference between SMT and SMD:

SMT (Surface Mount Technology) is essentially a technical method of arranging components on a circuit board, while SMD (Surface Mount Device) is an actual component mounted on a circuit board according to a specific component.

1. SMT (Surface Mount Technology): A new method of arranging components on printed circuit boards. SMT assembly is a more efficient process in which components are soldered directly to the board. By eliminating the need to pass the leads through the PCB, the process becomes faster, more efficient, and more cost-effective. At the same time, SMT assembly saves more space, allowing more components to be installed on a smaller board. This is why many devices now have many functions despite their small size.

SMT is a relatively complicated process, and the installation position of each component is strictly set to ensure that the circuit board achieves the best function. During SMT, before the machine installs each component, an appropriate amount of solder paste needs to be evenly applied to the board. However, mounting the components directly on the surface is more effective than wiring through the board, allowing the entire circuit board to run faster and with a smaller surface area.

In addition, surface mount technology also has the possibility of automation, and the machine can be programmed to directly mount the selected components on the PCB in a short time. This means faster production processes, higher quality and lower risks.

2. SMD (Surface Mount Device): The actual component mounted on the printed circuit board. Nowadays, the pins used by newer SMDs can be soldered directly to the PCB instead of using leads to route through the circuit board. There are many advantages to using pins over leads. For example, smaller components can be used to achieve the same function, which means that more components can be mounted on a smaller circuit board, and functionality can also be increased. At the same time, because there is no need to drill holes in the board, the installation process is faster and more cost-effective.

Compared with the previous manual soldering of SMD, SMD (such as resistors, ICs and other components) can be automatically mounted on the surface of the PCB. Through the correct layout process, SMD can operate at an efficient level for a longer period of time.

In summary, the main difference between the two is: one refers to the installation process (SMT) and the other refers to the actual component (SMD). But in many cases, the two overlap: For example, the correct selection and placement of SMD is the main process of SMT, and SMT assembly is a workflow or strategy for more effective use of SMD.

Finally, using the right technology can greatly improve the prototype. For example, an automatic SMT machine can mount thousands of SMDs on a circuit board in a short time. In addition, the choice of SMD will determine the effectiveness of the entire SMT, SMD determines the physical capacity of the electronic board (area), and SMT installs these components on the board in time.

The above is about the difference between SMT and SMD, I hope it can be helpful to everyone!