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Time of issue:2020-07-15 00:00:00
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What are the characteristics of SMT devices in PCBA processing

(Summary description)SMT components in PCBA processing are commonly known as leadless components or chip components, and components are divided into active components and passive components. People are accustomed to refer to passive components such as chip resistors, capacitors, and inductors as SMC, while active components such as small outline transistors SOT and flat components (QFP) are called SMD. Both SMC and SMD are functionally the same as traditional through-hole mounting components.
However, its small size, good high-frequency characteristics, vibration resistance, compact installation and other advantages are unmatched by traditional through-hole components, which has greatly stimulated the development of electronic products in the direction of multi-function, high-performance, miniaturization, and low-cost. .
At the same time, these miniature electronic products have promoted the continued development of...

What are the characteristics of SMT devices in PCBA processing

(Summary description)SMT components in PCBA processing are commonly known as leadless components or chip components, and components are divided into active components and passive components. People are accustomed to refer to passive components such as chip resistors, capacitors, and inductors as SMC, while active components such as small outline transistors SOT and flat components (QFP) are called SMD. Both SMC and SMD are functionally the same as traditional through-hole mounting components.
However, its small size, good high-frequency characteristics, vibration resistance, compact installation and other advantages are unmatched by traditional through-hole components, which has greatly stimulated the development of electronic products in the direction of multi-function, high-performance, miniaturization, and low-cost. .
At the same time, these miniature electronic products have promoted the continued development of...

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SMT components in PCBA processing are commonly known as leadless components or chip components, and components are divided into active components and passive components. People are accustomed to refer to passive components such as chip resistors, capacitors, and inductors as SMC, while active components such as small outline transistors SOT and flat components (QFP) are called SMD. Both SMC and SMD are functionally the same as traditional through-hole mounting components.

 

However, its small size, good high-frequency characteristics, vibration resistance, compact installation and other advantages are unmatched by traditional through-hole components, which has greatly stimulated the development of electronic products in the direction of multi-function, high-performance, miniaturization, and low-cost. .

 

At the same time, these miniature electronic products have promoted the continued development of SMC and SMD towards miniaturization.

 

The SMT components are directly attached to the surface of the PCB, and the electrodes are soldered on the pads on the same side as the components. The diameter of the through hole on the PCB is determined by the process level of the metallized hole when the circuit board is made, and there are no pads around the through hole, so the PCB wiring density and assembly density are greatly improved.

 

 

The distance between adjacent electrodes of SMT integrated circuits is much smaller than the standard lead spacing (2.54mm) of traditional THT integrated circuits. Chip resistors and capacitors have been reduced from 3.2mm*1.6mm in the early days to 0.4mm*0.2mm, and the center distance of IC pins has been reduced from 1.27mm to 0.3mm. With the development of bare chip technology, BGA and CSP types Multi-pin devices have been widely used in production.

 

In addition, some electromechanical components, such as switches, relays, filters, delay lines, etc., are also chip-based.

 

On the electrodes of SMT components, some solder ends have no leads at all, and some have very short leads.

 

In the case of the same degree of integration, the volume of the SMT device is much smaller than that of the THT component, and in the case of the same volume, the degree of integration of the SMT device is also much higher than that of the THT component.

 

The above is about the characteristics of SMT devices in PCBA processing, I hope it can be helpful to everyone!

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