Nowadays, with the continuous development of electronic products in the direction of miniaturization, lightness and thinness, the entire electronic industry has become more and more stringent on the reliability of PCBA. As the volume of electronic products becomes smaller, the volume of PCBA boards is getting smaller and smaller, and the density of PCBA processing and assembly is getting higher and higher. At the same time, it also means that the solder joints of the circuit board are getting smaller and smaller. It is precisely because the solder joints become smaller that many process details are difficult to control and deal with in place, so we often encounter the problem of PCBA solder joint failure in the daily processing. So, what are the factors that cause the solder joint failure? Let's take a look at the following Sanjing:

①The component pin is bad. The main reason is that the pins are contaminated or oxidized, which causes the solder joints to fail.

②The PCB pad is bad. The coating is contaminated, the surface is oxidized, and warping occurs.

③Flux quality defects. Low flux, low efficiency, and highly corrosive.

④ Defects in solder quality. The composition is unreasonable, the impurities exceed the standard, and oxidation occurs.

⑤ Defects in other auxiliary materials. Such as adhesives, cleaning agents, quality problems, etc.

⑥ Process parameter control defects. Unreasonable design, poor process control, deviation of equipment debugging.

PCBA solder joint failure has a great influence on the performance of the circuit board. Therefore, in the PCBA processing process, the soldering process, structural parameters, and solder joint reliability should be continuously improved according to the actual situation to ensure the quality of PCBA and avoid or reduce product defects. Thereby improving the yield rate of PCBA processing.

The above is the reason for the failure of PCBA processing solder joints, I hope it can be helpful to everyone!