Bluetooth audio circuit board from China manufacturer Before designing a multilayer circuit board, the structure of the multilayer circuit board used must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board.

　　The general principles of the multi-layer circuit board stacking arrangement adopted by the Bluetooth audio circuit board from China manufacturer:

　　1) Below the device surface (the second layer) is the ground plane, which provides the device shielding layer and the reference plane for the device surface wiring;

　　2) All signal layers of the multi-layer circuit board should be adjacent to the ground plane as much as possible;

　　3) Bluetooth audio circuit board from China manufacturer recommends that the two signal layers be avoided directly adjacent to each other;

　　4) The main power supply should be adjacent to it as much as possible;

　　5) In principle, the Bluetooth audio circuit board from China manufacturer should adopt a symmetrical structure design. The meaning of symmetry includes: dielectric layer thickness and type, copper foil thickness, graphics;

　　6) Symmetry of the distribution type of the multilayer circuit board (large copper foil layer, circuit layer).

　　Bluetooth audio circuit board from China manufacturer When setting the layers of a specific multi-layer circuit board, it is necessary to flexibly grasp the above principles. On the basis of understanding the above principles, according to the needs of the actual single board, such as: whether a key wiring layer is required , power supply, the division of the ground plane, etc., determine the layout of the layers, and do not copy them.