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Time of issue:2020-07-15 00:00:00
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Precautions for PCBA Sub-board Process
Precautions
Generally speaking, after the PCBA assembly process is completed, the PCBA panels need to be separated. Because some PCB boards are small in size, they are usually made into the form of paneling. However, pay special attention when splitting the board. If you are not careful, it is easy to damage the intact PCBA board. There are two ways to split the board: one is manual splitting; the other is machine splitting. There are different ways of dividing the board, and the matters needing attention are also different. The following Sanjing will take you to understand:
(1) Manual sub-board
When folding the edge of the board, you must hold the lower edge of the PCBA board with both hands, try to avoid bending...
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Generally speaking, after the PCBA assembly process is completed, the PCBA panels need to be separated. Because some PCB boards are small in size, they are usually made into the form of paneling. However, pay special attention when splitting the board. If you are not careful, it is easy to damage the intact PCBA board. There are two ways to split the board: one is manual splitting; the other is machine splitting. There are different ways of dividing the board, and the matters needing attention are also different. The following Sanjing will take you to understand:
(1) Manual sub-board
When folding the edge of the board, you must hold the lower edge of the PCBA board with both hands, try to avoid bending...
How to control the quality of PCBA processing
How
We know that the process of PCBA processing is very cumbersome, no matter which part of the problem occurs, it will lead to poor product processing. So how to control the quality of PCBA processing? Let’s take a look at the following Sanjing:
Quality control is an important step to ensure product quality and production efficiency, so the most important thing is to establish a complete quality management system (ISO). Take reflow soldering as an example. Although the temperature in the furnace can be controlled by the furnace temperature control system and temperature sensor in the reflow soldering, the actual temperature of the solder joints on the PCB is not necessarily equal to the preset temperature of the reflow soldering. Although the reflow soldering machine works normally and the temperature control is...
See more information
We know that the process of PCBA processing is very cumbersome, no matter which part of the problem occurs, it will lead to poor product processing. So how to control the quality of PCBA processing? Let’s take a look at the following Sanjing:
Quality control is an important step to ensure product quality and production efficiency, so the most important thing is to establish a complete quality management system (ISO). Take reflow soldering as an example. Although the temperature in the furnace can be controlled by the furnace temperature control system and temperature sensor in the reflow soldering, the actual temperature of the solder joints on the PCB is not necessarily equal to the preset temperature of the reflow soldering. Although the reflow soldering machine works normally and the temperature control is...
Types of residues on PCBA
Types
With the development of the electronic information industry, PCBA assembly process requirements are getting higher and higher, and the quality and reliability of electronic products depend on the quality and reliability of PCBA. However, from the process practice and PCBA failure analysis, it is known that the quality and reliability of PCBA are also affected by many factors, such as welding residue. The following Sanjing will introduce you:
During the soldering process, the residues are generally flux residues, by-products of the reaction between flux and solder, adhesives, lubricating oil, etc., or other relatively small potential hazards such as contaminants carried in the production and transportation of PCB components. These residues are generally divided into three types: one is non-polar residues, mainly including rosin, resin, adhesives, lubricating oil, etc. These residues are generally cleaned with non-polar cleaning solvents to be better removed; the second type It is a polar residue, also called an ionic residue, which mainly...
See more information
With the development of the electronic information industry, PCBA assembly process requirements are getting higher and higher, and the quality and reliability of electronic products depend on the quality and reliability of PCBA. However, from the process practice and PCBA failure analysis, it is known that the quality and reliability of PCBA are also affected by many factors, such as welding residue. The following Sanjing will introduce you:
During the soldering process, the residues are generally flux residues, by-products of the reaction between flux and solder, adhesives, lubricating oil, etc., or other relatively small potential hazards such as contaminants carried in the production and transportation of PCB components. These residues are generally divided into three types: one is non-polar residues, mainly including rosin, resin, adhesives, lubricating oil, etc. These residues are generally cleaned with non-polar cleaning solvents to be better removed; the second type It is a polar residue, also called an ionic residue, which mainly...
Causes and solutions of virtual welding in PCBA processing
Causes
PCBA virtual soldering is also commonly referred to as cold soldering. The surface looks welded, but there is no actual internal connection, or it is in an unstable state when it is connected. This will not only affect the circuit characteristics, but may even cause the PCB quality to be unqualified. Or scrap. Therefore, we have to pay attention to the phenomenon of virtual welding. However, what is the cause of the false welding? And is there a solution? Let’s take a look at the following Sanjing:
The main reasons for the virtual soldering are: 1. Oxidation of pads and component pins: Oxidation of pads and component pins can easily lead to solder reflow, the solder paste cannot fully infiltrate the pads in the liquefied state, but it is easy to climb tin.
2. Less tin: In the solder paste printing process, due to the small opening of the stencil or the excessive pressure of the scraper, the amount of tin is insufficient during soldering, and the components cannot be fully soldered.
3. The temperature is too high or too low: Too high temperature will cause the solder...
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PCBA virtual soldering is also commonly referred to as cold soldering. The surface looks welded, but there is no actual internal connection, or it is in an unstable state when it is connected. This will not only affect the circuit characteristics, but may even cause the PCB quality to be unqualified. Or scrap. Therefore, we have to pay attention to the phenomenon of virtual welding. However, what is the cause of the false welding? And is there a solution? Let’s take a look at the following Sanjing:
The main reasons for the virtual soldering are: 1. Oxidation of pads and component pins: Oxidation of pads and component pins can easily lead to solder reflow, the solder paste cannot fully infiltrate the pads in the liquefied state, but it is easy to climb tin.
2. Less tin: In the solder paste printing process, due to the small opening of the stencil or the excessive pressure of the scraper, the amount of tin is insufficient during soldering, and the components cannot be fully soldered.
3. The temperature is too high or too low: Too high temperature will cause the solder...
The main factors affecting the cost of PCBA foundry materials
The
We know that PCBA foundry material is a type of PCBA processing, and it is also a very common way in patch processing plants. However, since it is a foundry substitute, you have to consider the cost issue. The following Sanjing will take you to understand the factors that affect PCBA foundry substitutes:
(1) First, the versatility of PCBA processing materials. Material versatility includes two types: one is that the material has a common standard in the industry, and the other is that there is no common standard for the material in the material industry, and it needs to be customized. So for the second case, how to improve the versatility of materials?
In the product planning and design phase, product planning and researchers should pay more attention to their areas of expertise, such as how to better implement product functions...
See more information
We know that PCBA foundry material is a type of PCBA processing, and it is also a very common way in patch processing plants. However, since it is a foundry substitute, you have to consider the cost issue. The following Sanjing will take you to understand the factors that affect PCBA foundry substitutes:
(1) First, the versatility of PCBA processing materials. Material versatility includes two types: one is that the material has a common standard in the industry, and the other is that there is no common standard for the material in the material industry, and it needs to be customized. So for the second case, how to improve the versatility of materials?
In the product planning and design phase, product planning and researchers should pay more attention to their areas of expertise, such as how to better implement product functions...
PCB manufacturability design and PCBA assembly design
PCB
We know that although PCB and PCBA seem to differ by only one letter "A", there is a big difference. PCBA manufacturability design includes two parts: PCB manufacturability design and PCBA assembly (assembly) design. Let’s take a look at the following Sanjing:
PCB manufacturability design: more emphasis on "manufacturability", the design content mainly includes: plate selection, press-fit structure design, ring design, solder mask design, surface treatment and imposition design, etc., these designs are in line with PCB It is related to the processing capacity and is limited by the processing method and capacity. The designed minimum line width and line spacing, minimum aperture, minimum pad ring width, minimum solder mask gap, etc. must meet the processing capabilities of the PCB. At the same time, the designed laminate and laminated structure...
See more information
We know that although PCB and PCBA seem to differ by only one letter "A", there is a big difference. PCBA manufacturability design includes two parts: PCB manufacturability design and PCBA assembly (assembly) design. Let’s take a look at the following Sanjing:
PCB manufacturability design: more emphasis on "manufacturability", the design content mainly includes: plate selection, press-fit structure design, ring design, solder mask design, surface treatment and imposition design, etc., these designs are in line with PCB It is related to the processing capacity and is limited by the processing method and capacity. The designed minimum line width and line spacing, minimum aperture, minimum pad ring width, minimum solder mask gap, etc. must meet the processing capabilities of the PCB. At the same time, the designed laminate and laminated structure...
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