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Time of issue:2020-07-15 00:00:00
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What are the requirements of the SMT process for the placement machine
What
We know that the SMT placement machine is the electronic manufacturing equipment with the highest technical content and a large proportion of value in the SMT process. The SMT process has three main requirements for the placement machine: accurate placement, good placement, and fast placement. Below we will take a look at the specific items of these requirements.
(1) The stickers are accurate. There are two main elements for accurate placement: the correct components and the correct position of the components. ①The components are correct: the model, type, nominal value and other characteristic marks of the components in each assembly position must meet the product assembly and detail requirements, and the wrong position cannot be pasted. ②The position of the component is correct: the end or lead of the component and the position and angle of the target graphic should be aligned in the center as far as possible.
(2) It is posted well. There are three main criteria for good attachment: no damage...
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We know that the SMT placement machine is the electronic manufacturing equipment with the highest technical content and a large proportion of value in the SMT process. The SMT process has three main requirements for the placement machine: accurate placement, good placement, and fast placement. Below we will take a look at the specific items of these requirements.
(1) The stickers are accurate. There are two main elements for accurate placement: the correct components and the correct position of the components. ①The components are correct: the model, type, nominal value and other characteristic marks of the components in each assembly position must meet the product assembly and detail requirements, and the wrong position cannot be pasted. ②The position of the component is correct: the end or lead of the component and the position and angle of the target graphic should be aligned in the center as far as possible.
(2) It is posted well. There are three main criteria for good attachment: no damage...
The main role of SMT processing technology materials
The
We know that SMT processing materials are the basis of SMT patch processing and play a key role in the quality and production efficiency of SMT patch processing. At the beginning of SMT processing design and establishment of the production line, appropriate process materials must be selected according to the process flow and process requirements. SMT processing technology materials mainly include solder paste, solder, adhesives and other welding and patch materials, as well as flux, cleaning agents, heat transfer media and other process materials. Let us understand the main functions of these materials in the following Sanjing:
(1) Solder paste solder: Solder is an important structural material in the SMT chip process. It is used to connect the metal surface of the soldered object and form a solder joint. Different types of solder are used in different occasions. For example, solder paste is used for reflow soldering. It is also a welding material, and its viscosity can be used to pre-fix the SMC/SMD.
(2) Flux: Flux is also an important process material in the SMT process, and it is one of...
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We know that SMT processing materials are the basis of SMT patch processing and play a key role in the quality and production efficiency of SMT patch processing. At the beginning of SMT processing design and establishment of the production line, appropriate process materials must be selected according to the process flow and process requirements. SMT processing technology materials mainly include solder paste, solder, adhesives and other welding and patch materials, as well as flux, cleaning agents, heat transfer media and other process materials. Let us understand the main functions of these materials in the following Sanjing:
(1) Solder paste solder: Solder is an important structural material in the SMT chip process. It is used to connect the metal surface of the soldered object and form a solder joint. Different types of solder are used in different occasions. For example, solder paste is used for reflow soldering. It is also a welding material, and its viscosity can be used to pre-fix the SMC/SMD.
(2) Flux: Flux is also an important process material in the SMT process, and it is one of...
Lead-free SMT circuit board land requirements
Lead-free
So far, although the country has not put forward special requirements for the design of lead-free SMT circuit boards, and there is no unified SMT circuit board specification standard in the industry, in order to respond to the call of the country, it is necessary to consider circuit board material selection, manufacturing, use and Factors such as recovery costs.
When realizing lead-free SMT circuit board manufacturing, designers should always pay attention to DFM issues, the choice of circuit board surface plating, the choice of laminate materials and through-hole considerations, the choice of components, reliability issues, and Sn-Pb Solder and lead-free component soldering or lead-free solder is compatible with traditional leaded component soldering and other issues. Let’s take a look at the following Sanjing:
(1) In order to reduce the poor soldering on the surface of the printed circuit board during SMT patch processing, careful consideration should be given to heat dissipation design, such as uniform component distribution, copper foil distribution, printed circuit board...
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So far, although the country has not put forward special requirements for the design of lead-free SMT circuit boards, and there is no unified SMT circuit board specification standard in the industry, in order to respond to the call of the country, it is necessary to consider circuit board material selection, manufacturing, use and Factors such as recovery costs.
When realizing lead-free SMT circuit board manufacturing, designers should always pay attention to DFM issues, the choice of circuit board surface plating, the choice of laminate materials and through-hole considerations, the choice of components, reliability issues, and Sn-Pb Solder and lead-free component soldering or lead-free solder is compatible with traditional leaded component soldering and other issues. Let’s take a look at the following Sanjing:
(1) In order to reduce the poor soldering on the surface of the printed circuit board during SMT patch processing, careful consideration should be given to heat dissipation design, such as uniform component distribution, copper foil distribution, printed circuit board...
The design and requirements of the minimum spacing of SMT components
The
With the rapid development of the electronics industry, SMT chip processing is gradually developing in the direction of high precision and fine pitch. At the same time, the minimum pitch design of components can also test whether the production technology and process experience of SMT manufacturers are perfect. In addition to ensuring a safe distance between SMT pads that is not easy to short in the design of the minimum spacing of components, the maintainability of the components should also be considered.
However, there are many factors related to the spacing of components. Let us understand the following Sanjing:
①Tolerance of the external dimensions of the components and the heat released by the components. ②The rotation speed and positioning accuracy of the placement machine. ③The number of PCB layers used is known, and the space required for wiring design...
See more information
With the rapid development of the electronics industry, SMT chip processing is gradually developing in the direction of high precision and fine pitch. At the same time, the minimum pitch design of components can also test whether the production technology and process experience of SMT manufacturers are perfect. In addition to ensuring a safe distance between SMT pads that is not easy to short in the design of the minimum spacing of components, the maintainability of the components should also be considered.
However, there are many factors related to the spacing of components. Let us understand the following Sanjing:
①Tolerance of the external dimensions of the components and the heat released by the components. ②The rotation speed and positioning accuracy of the placement machine. ③The number of PCB layers used is known, and the space required for wiring design...
The difference between SMT assembly and THT assembly
The
With the rapid development of electronic technology, electronic products are becoming more and more miniaturized, and their weight and cost are therefore reduced. As far as SMT is concerned, SMC is mainly soldered to PCB by reflow soldering. Reflow soldering is carried out in a reflow oven. Although SMT components adhere to a high degree of automation, manual soldering is still very important in its manufacturing process.
Let's first understand the advantages of SMT assembly:
(1) High assembly density. Compared with traditional through-hole components, chip components require smaller circuit board space. The application of SMT components reduces the volume of electronic products by 60% and the weight by 75%.
(2) High reliability. The chip components are small in size, light in weight, and have high reliability...
See more information
With the rapid development of electronic technology, electronic products are becoming more and more miniaturized, and their weight and cost are therefore reduced. As far as SMT is concerned, SMC is mainly soldered to PCB by reflow soldering. Reflow soldering is carried out in a reflow oven. Although SMT components adhere to a high degree of automation, manual soldering is still very important in its manufacturing process.
Let's first understand the advantages of SMT assembly:
(1) High assembly density. Compared with traditional through-hole components, chip components require smaller circuit board space. The application of SMT components reduces the volume of electronic products by 60% and the weight by 75%.
(2) High reliability. The chip components are small in size, light in weight, and have high reliability...
What are the characteristics of SMT devices in PCBA processing
What
SMT components in PCBA processing are commonly known as leadless components or chip components, and components are divided into active components and passive components. People are accustomed to refer to passive components such as chip resistors, capacitors, and inductors as SMC, while active components such as small outline transistors SOT and flat components (QFP) are called SMD. Both SMC and SMD are functionally the same as traditional through-hole mounting components.
However, its small size, good high-frequency characteristics, vibration resistance, compact installation and other advantages are unmatched by traditional through-hole components, which has greatly stimulated the development of electronic products in the direction of multi-function, high-performance, miniaturization, and low-cost. .
At the same time, these miniature electronic products have promoted the continued development of...
See more information
SMT components in PCBA processing are commonly known as leadless components or chip components, and components are divided into active components and passive components. People are accustomed to refer to passive components such as chip resistors, capacitors, and inductors as SMC, while active components such as small outline transistors SOT and flat components (QFP) are called SMD. Both SMC and SMD are functionally the same as traditional through-hole mounting components.
However, its small size, good high-frequency characteristics, vibration resistance, compact installation and other advantages are unmatched by traditional through-hole components, which has greatly stimulated the development of electronic products in the direction of multi-function, high-performance, miniaturization, and low-cost. .
At the same time, these miniature electronic products have promoted the continued development of...
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