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Time of issue:2020-07-15 00:00:00
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SMT贴片机的发展方向及趋势
SMT贴片机的发展方向及趋势
With the rapid development of SMT, the size of components has become smaller and smaller, the density of SMT patches has become higher and higher, and many new packaging forms have been continuously introduced. In order to meet the needs of high-density and difficult SMT patch processing and assembly technology, SMT placement machines are developing in the direction of high speed, multi-function, modularization and intelligence.
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...
See more information
With the rapid development of SMT, the size of components has become smaller and smaller, the density of SMT patches has become higher and higher, and many new packaging forms have been continuously introduced. In order to meet the needs of high-density and difficult SMT patch processing and assembly technology, SMT placement machines are developing in the direction of high speed, multi-function, modularization and intelligence.
The following Sanjing will take you to understand the development direction of SMT placement machines:
(1) High precision
In order to meet the requirements of narrow pitch and new devices for SMT placement accuracy, many SMT placement machine manufacturers currently adopt various technologies to improve placement accuracy: mainly reflected in the following aspects:...
Knowledge about SMT equipment maintenance
Knowledge
We know that the general SMT is divided into three parts, one is the hardware (HARDWARE), the process (PROCESS) and the program (PROGRAM).
Hardware is the foundation of the entire SMT. Without hardware equipment, there will be no process and program. This is also true in practical applications. However, under normal circumstances, people are generally more concerned about the SMT process than the hardware and the program. The following Sanjing will take you to understand:
Most of the manufacturing process is controlled by the temperature profile (PROFILE), and the adjustment of the temperature profile is also based on the hardware. However, sometimes due to patching, there may be problems in the manufacturing process, and most of the problems caused by patching are related to hardware. Therefore, SMT equipment maintenance is essential. If the SMT equipment is properly...
See more information
We know that the general SMT is divided into three parts, one is the hardware (HARDWARE), the process (PROCESS) and the program (PROGRAM).
Hardware is the foundation of the entire SMT. Without hardware equipment, there will be no process and program. This is also true in practical applications. However, under normal circumstances, people are generally more concerned about the SMT process than the hardware and the program. The following Sanjing will take you to understand:
Most of the manufacturing process is controlled by the temperature profile (PROFILE), and the adjustment of the temperature profile is also based on the hardware. However, sometimes due to patching, there may be problems in the manufacturing process, and most of the problems caused by patching are related to hardware. Therefore, SMT equipment maintenance is essential. If the SMT equipment is properly...
PCB component layout and pad design
PCB
We know that the PCB will be designed before production. If the PCB design is unreasonable, it will affect the subsequent PCB production. Therefore, you need to pay attention to many issues when designing the PCB. The following Sanjing will let you know about the layout and welding of PCB components. Disk design.
(1) PCB component layout
① The components on the PCB should be evenly distributed, and the high-power components should be dispersed to avoid local overheating on the PCB when the circuit is working, which will affect the reliability of the solder joints.
②For double-sided mounting components, the larger components on both sides should be installed in a...
See more information
We know that the PCB will be designed before production. If the PCB design is unreasonable, it will affect the subsequent PCB production. Therefore, you need to pay attention to many issues when designing the PCB. The following Sanjing will let you know about the layout and welding of PCB components. Disk design.
(1) PCB component layout
① The components on the PCB should be evenly distributed, and the high-power components should be dispersed to avoid local overheating on the PCB when the circuit is working, which will affect the reliability of the solder joints.
②For double-sided mounting components, the larger components on both sides should be installed in a...
What are the characteristics of SMT patch processing and assembly
What
We know that SMT chip processing and assembly printed circuit boards have become the mainstream products of current SMT chip manufacturers. Almost all circuit boards are SMT chip processing, and their functions are the same as those of through-hole circuit board processing. The printed circuit boards used as SMT processing assembly and interconnection must adapt to the rapid development of the current SMT patch assembly technology. The following Sanjing take everyone to understand the characteristics of SMT patch processing and assembly:
①High density: As the number of pins processed by SMT chip can reach hundreds or even thousands, and the center distance between pins can reach 0.3mm, the high-precision BGA on the circuit board requires fine lines and fine spacing, and the line width ranges from 0.2 to 0.3 The mm has been reduced to 0.1mm or even 0.05mm, and the 2.54mm grid has developed to 4, 5 or even 6 wires. The fine line and fine pitch greatly improve the assembly density of SMT, and the corresponding SMT processing plant can complete the corresponding SMT processing equipment with high precision.
②Small aperture: Most of the metallized holes in SMT are not used to insert component pins, and no welding is...
See more information
We know that SMT chip processing and assembly printed circuit boards have become the mainstream products of current SMT chip manufacturers. Almost all circuit boards are SMT chip processing, and their functions are the same as those of through-hole circuit board processing. The printed circuit boards used as SMT processing assembly and interconnection must adapt to the rapid development of the current SMT patch assembly technology. The following Sanjing take everyone to understand the characteristics of SMT patch processing and assembly:
①High density: As the number of pins processed by SMT chip can reach hundreds or even thousands, and the center distance between pins can reach 0.3mm, the high-precision BGA on the circuit board requires fine lines and fine spacing, and the line width ranges from 0.2 to 0.3 The mm has been reduced to 0.1mm or even 0.05mm, and the 2.54mm grid has developed to 4, 5 or even 6 wires. The fine line and fine pitch greatly improve the assembly density of SMT, and the corresponding SMT processing plant can complete the corresponding SMT processing equipment with high precision.
②Small aperture: Most of the metallized holes in SMT are not used to insert component pins, and no welding is...
SMT welding inspection and defect effects
SMT
As we all know, SMT soldering is one of the important links in the assembly process of electronic products. If there is no corresponding SMT welding process quality assurance, any well-designed electronic device will be difficult to achieve the design index. Therefore, the solder joints must be strictly inspected during soldering to avoid the occurrence of unqualified solder joints quality problems leading to unqualified electronic products. Let's take a look at the various SMT soldering problems in the following Sanjing.
After the SMT welding operation is over, in order to make the product have reliable performance, the welding quality must be inspected. Welding inspection is generally a visual inspection, not just to inspect the solder joints, but also to check the conditions around the solder joints. For example: due to a series of problems caused by welding, the inspection of the wiring and welding of the terminal is to check from the welding state, ①check whether the...
See more information
As we all know, SMT soldering is one of the important links in the assembly process of electronic products. If there is no corresponding SMT welding process quality assurance, any well-designed electronic device will be difficult to achieve the design index. Therefore, the solder joints must be strictly inspected during soldering to avoid the occurrence of unqualified solder joints quality problems leading to unqualified electronic products. Let's take a look at the various SMT soldering problems in the following Sanjing.
After the SMT welding operation is over, in order to make the product have reliable performance, the welding quality must be inspected. Welding inspection is generally a visual inspection, not just to inspect the solder joints, but also to check the conditions around the solder joints. For example: due to a series of problems caused by welding, the inspection of the wiring and welding of the terminal is to check from the welding state, ①check whether the...
Advantages and disadvantages of SMT chip processing BGA
Advantages
Before introducing the advantages and disadvantages of BGA, Sanjing will give you a brief understanding of BGA:
BGA is a packaging method for SMT chip processing. BGA is the abbreviation of Ball Grid Array in English. With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, stronger performance requirements, smaller volume requirements, and lighter weight requirements. This has promoted the trend of electronic products. Multifunctional, high-performance, miniaturization and light-weight development. In order to achieve this goal, the size of IC chips is getting smaller and smaller, and the complexity is increasing. Therefore, the number of...
See more information
Before introducing the advantages and disadvantages of BGA, Sanjing will give you a brief understanding of BGA:
BGA is a packaging method for SMT chip processing. BGA is the abbreviation of Ball Grid Array in English. With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, stronger performance requirements, smaller volume requirements, and lighter weight requirements. This has promoted the trend of electronic products. Multifunctional, high-performance, miniaturization and light-weight development. In order to achieve this goal, the size of IC chips is getting smaller and smaller, and the complexity is increasing. Therefore, the number of...
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