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Time of issue:2020-07-15 00:00:00
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Causes and defenses of Switch pcba in china deformation

Causes and defenses of Switch pcba in china deformation

  • Categories:Switch pcba
  • Author:
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  • Time of issue:2022-12-15
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(Summary description)In Switch pcba in China proofing, how to reduce or eliminate deformation caused by different material properties or processing has become one of the most complicated problems faced by Switch pcba in China manufacturers. Here are some of these deformation causes:

Causes and defenses of Switch pcba in china deformation

(Summary description)In Switch pcba in China proofing, how to reduce or eliminate deformation caused by different material properties or processing has become one of the most complicated problems faced by Switch pcba in China manufacturers. Here are some of these deformation causes:

  • Categories:Switch pcba
  • Author:
  • Origin:
  • Time of issue:2022-12-15
  • Views:0
Information

  In Switch pcba in China proofing, how to reduce or eliminate deformation caused by different material properties or processing has become one of the most complicated problems faced by Switch pcba in China manufacturers. Here are some of these deformation causes:

quality Switch pcba Manufacturers china

  1. The weight of the Switch pcba in China will cause the board to sag and deform

  Generally, the reflow furnace will use a chain to drive the circuit board forward in the reflow furnace. If there are overweight parts on the board, or the size of the board is too large, it will appear in the middle due to its own weight. bend.

  2. The depth and connecting strip of Switch pcba in china V-Cut will affect the deformation of the jigsaw panel

  V-Cut is to cut grooves on the original large sheet, so the place where V-Cut appears is prone to deformation.

  3. Deformation caused during the processing of Switch pcba in China

  The reason for the deformation of Switch pcba in China during processing is very complicated, which can be divided into two types: thermal stress and mechanical stress. Among them, the thermal stress is mainly generated during the pressing process, and the mechanical stress is mainly generated during the stacking, handling, and baking processes of the plates.

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