The PCBA processing process involves many links. To produce a good product, the quality of each link must be controlled. Generally, PCBA consists of a series of processes such as PCB circuit board manufacturing, component procurement and inspection, SMT chip processing, plug-in processing, program firing, testing and aging. The following Sanjing will take you to understand:

PCB circuit board manufacturing: After receiving the PCBA order, analyze the Gerber file, pay attention to the relationship between the PCB hole spacing and the board's carrying capacity, and will not cause bending or breakage. Whether the wiring considers key factors such as high-frequency signal interference and impedance.

Component procurement and inspection: The procurement of components requires strict channel control, purchase from large merchants and original factories, and strictly eliminate second-hand and counterfeit materials. At the same time, a special incoming inspection post can be set up to strictly inspect PCB, IC and other commonly used materials to prevent defects in parts. PCB mainly checks the reflow oven temperature test, prohibiting flying wires, whether holes are blocked or leaking ink, whether the board surface is bent, etc.; while IC mainly checks whether the screen is consistent with the BOM, and maintains constant temperature and humidity. In addition, the silk screen, appearance, start-up measurement, etc. must be checked. The inspection items are carried out according to the random inspection method.

SMT assembly processing: solder paste printing and reflow oven temperature control are the key, and the quality and process requirements of the laser stencil are very important. According to the requirements of the PCB, some need to increase or decrease the steel mesh, or use U-shaped holes to make the steel mesh according to the process requirements. The temperature and speed control of the reflow soldering furnace is very important to the solder paste infiltration and soldering reliability. SOP operation guide for control. In addition, AOI testing must be strictly implemented to minimize the adverse effects caused by human factors.

Dip plug-in processing: In the process of plug-in assembly, the mold design of wave soldering is the key. How to use molds to provide the best products after the furnace is a process that PE engineers must continue to practice and sum up experience.

Program burning: In the previous DFM report, customers can suggest setting some test points on the PCB, the purpose is to test the continuity of the PCB and PCBA circuit after all components are soldered.

PCBA board test: The main test content includes ICT circuit test, FCT function test, aging test, temperature and humidity test, drop test, etc. For orders with PCBA test requirements, it is necessary to operate according to the customer's test plan and summarize the report data.

The above is about the PCBA processing procedures and precautions, I hope it can be helpful to everyone!