Audio circuit pc board manufacturers believe that FR4 epoxy glass fiber substrates are used for general electronic products, polyimide glass fiber substrates are used for high ambient temperature or flexible circuit boards, and polytetrafluoroethylene is required for high-frequency circuits. Vinyl fiberglass substrate; metal substrates should be used for electronic products with high heat dissipation requirements.

　　Audio circuit pc board manufacturers talk about the factors that should be considered when choosing PCB materials:

　　(1) The audio circuit pc board manufacturer recommends that a substrate with a higher glass transition temperature (Tg) should be appropriately selected, and the Tg should be higher than the circuit operating temperature.

　　(2) The coefficient of thermal expansion (CTE) is required to be low. Due to the inconsistent thermal expansion coefficients in the X, Y and thickness directions, it is easy to cause PCB deformation, and in severe cases, the metallized holes will be broken and components will be damaged.

　　(3) Audio circuit pc board manufacturers require high heat resistance. Generally, the PCB is required to have a heat resistance of 250°C/50S.

　　(4) Good flatness is required. The PCB warpage requirement of SMT is <0.0075mm/mm.

　　(5) In terms of electrical performance of audio circuit pc board manufacturers, high-frequency circuits require the selection of materials with high dielectric constant and low dielectric loss. Insulation resistance, withstand voltage strength, and arc resistance must meet product requirements.