In the process of Small home pcba processing, there are many production processes, which are prone to many quality problems. At this time, it is necessary to continuously improve the Small home pcba welding method and improve the process in order to effectively improve the product quality.

　　1. Small home pcba improves the temperature and time of welding

　　The processing reaction time of Small home pcba patch is too long, whether it is due to the welding time is too long or the temperature is too high or both, it will lead to a rough crystalline structure, which is gritty and brittle, shearing less intensity.

　　2. Small home pcba reduces surface tension

　　Small home pcba tin-lead solder is even more cohesive than water, making the solder spherical to minimize its surface area. The action of the flux is similar to that of the cleaning agent on the metal plate coated with grease. In addition, the surface tension is also highly dependent on the cleanliness and temperature of the surface. Only when the adhesion energy is much greater than the surface energy can ideal tinning occur.

　　3.Small home pcba dip tin corner

　　About 35°C above the eutectic point of the solder, when a drop of solder is placed on a hot flux-coated surface, a meniscus is formed, to some extent, the ability of the metal surface to wet with tin. It can be assessed by the shape of the meniscus.