1. PCB circuit board manufacturing. After receiving the PCBA order, analyze the Gerber file, pay attention to the relationship between the PCB hole spacing and the board's bearing capacity, do not cause bending or breakage, and whether the wiring considers key factors such as high-frequency signal interference and impedance.

2. Procurement and inspection of components. The procurement of components requires strict control of channels, and must be picked up from large traders and original factories, and 100% avoid second-hand materials and fake materials. In addition, a special inspection post for incoming materials is set up, and the following items are strictly inspected to ensure that the components are free of faults.

3. SMT Assembly processing. Solder paste printing and reflow oven temperature control are key points, and it is very important to use laser stencils of good quality and meeting process requirements. According to the requirements of PCB, some steel mesh holes need to be enlarged or reduced, or U-shaped holes are used to make steel mesh according to process requirements. The temperature and speed control of the reflow soldering furnace is critical to the solder paste infiltration and soldering reliability. It can be controlled in accordance with the normal SOP operation guidelines. In addition, AOI testing needs to be strictly implemented to minimize defects caused by human factors.

4. DIP plug-in processing. In the plug-in process, the mold design for wave soldering is the key point. How to use the mold to maximize the yield after the furnace is a process that must be practiced and summed up.

5. Program firing. In the previous DFM report, customers can be suggested to set up some test points on the PCB, the purpose is to test the PCB and PCBA circuit continuity after soldering all components. If you have conditions, you can ask the customer to provide a program, and burn the program into the main control IC through the burner, you can more intuitively test the functional changes brought about by various touch actions, so as to test the function of the entire PCBA Completeness.

6. PCBA board test. For orders with PCBA test requirements, the main test content includes ICT, FCT, aging test, temperature and humidity test, drop test, etc., which can be operated according to the customer's test plan and summarized report data.

The above is about the content of the PCBA processing quality agreement, I hope it can be helpful to everyone!