As we all know, in addition to PCBA production and processing, PCBA repair is also a very important link. Once the repair process is not good, the PCBA board will be scrapped, which will affect the product yield. So, what are the requirements for PCBA board rework? The following Sanjing will give you a brief understanding:

First of all, the first is the baking requirements of PCBA and moisture-sensitive components.

All new components to be installed must be baked and dehumidified in accordance with the moisture sensitivity level and storage conditions of the components and the relevant requirements in the "Specifications for the Use of Moisture Sensitive Components". If the repair process needs to be heated to above 110°C, or there are other moisture-sensitive components within 5mm of the repaired area, it must also be carried out according to the moisture sensitivity level and storage conditions of the components and the relevant requirements in the "Specifications for the Use of Moisture Sensitive Components" Bake and dehumidify.

For moisture-sensitive components that need to be reused after repair, if hot air reflow, infrared, etc. are used to heat the solder joints through the component package, it must be based on the moisture sensitivity level and storage conditions of the components, and in accordance with The relevant requirements in the "Code" require baking and dehumidification treatment. For the rework process that uses manual ferrochrome heating solder joints, under the premise that the heating process is controlled, pre-baking treatment is not necessary.

The second is the storage environment requirements for PCBA and components after baking. After baking, moisture-sensitive components, PCBA, and unpacked new components to be replaced, once the storage conditions exceed the expiration date, they need to be re-baked.

The last one is the requirement of PCBA rework heating times. The allowable repair heating times for components do not exceed 4 times; the allowable repair heating times for new components do not exceed 5 times; the allowable repair heating times for reusable components that are disassembled do not exceed 3 times.

The above is the requirement for PCBA board rework, I hope it can be helpful to everyone!